Results 151 to 160 of about 17,458,674 (303)

Engineering Vanderbilt; Vol. 50 No. 01, 2009

open access: yes, 2009
Engineering Vanderbilt (formerly Engineering News) is the newsletter of the Vanderbilt University School of Engineering.Vanderbilt University.
Vanderbilt University. School of Engineering
core  

Hierarchically Wrinkled Silver Ink as a Platform for Fully Integrated Stretchable Electronic Systems

open access: yesAdvanced Materials Technologies, EarlyView.
Silver Hierarchical Responsive ink (SHRink), a universal approach for the fabrication of highly stretchable interconnects, wirings, and skin‐interfaced electrodes, is realized through low‐cost, scalable spray‐printing and transfer‐printing. The SHRink demonstrates high electrical conductivity (1.2E04 S cm−1) and large stretchability (235% max fracture ...
Junye Li   +11 more
wiley   +1 more source

Engineering Vanderbilt; Vol. 52, No. 02, 2011

open access: yes, 2011
Engineering Vanderbilt (formerly Engineering News) is the newsletter of the Vanderbilt University School of Engineering.Vanderbilt University.
Vanderbilt University. School of Engineering
core  

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na   +7 more
wiley   +1 more source

Engineering Vanderbilt; Vol. 44 No. 01, 2003

open access: yes, 2003
Engineering Vanderbilt (formerly Engineering News) is the newsletter of the Vanderbilt University School of EngineeringSchool of ...
Vanderbilt University. School of Engineering
core  

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

open access: yesAdvanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju   +2 more
wiley   +1 more source

Engineering Vanderbilt; Vol. 52, No. 01, 2011

open access: yes, 2011
Engineering Vanderbilt (formerly Engineering News) is the newsletter of the Vanderbilt University School of Engineering.Vanderbilt University.
Vanderbilt University. School of Engineering
core  

Moisture‐Adaptive Triboelectric Materials and Platforms: Design Strategies, Performance Enhancement, and Applications in Energy Harvesting and Wearable Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review summarizes moisture‐adaptive strategies that enable triboelectric nanogenerators (TENGs) to operate across diverse moisture conditions. It examines moisture‐management methods, including exclusion, directional transport, removal, and utilization, with charge‐regulation approaches based on interfacial, dielectric, and structural engineering.
Junzhe Gan   +4 more
wiley   +1 more source

Engineering Vanderbilt; Vol. 43 No. 02, 2002

open access: yes, 2002
Engineering Vanderbilt (formerly Engineering News) is the newsletter of the Vanderbilt University School of EngineeringSchool of ...
Vanderbilt University. School of Engineering
core  

Home - About - Disclaimer - Privacy