Results 201 to 210 of about 7,840,882 (325)
Sharing standards: standardizing the European information society [PDF]
Roy Rada, John Ketchell
openalex +1 more source
Heat Conduction Modulation in Incommensurate Twisted Stacking of Transition‐Metal Dichalcogenide
The interlayer thermal conductance in twisted bilayer TMDs is initially investigated experimentally by the thermoreflectance method. The overlap of lattice vibrations within individual layers and the interlayer interactions, as elucidated through both Raman spectroscopy and molecular dynamics simulations, are demonstrated to be critical factors in ...
Bin Xu+6 more
wiley +1 more source
Engagement of the Ministry of Defense and Bulgarian Armed Forces in Establishing Information Society [PDF]
V. Grigorov
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Information society and criminal justice: report for Belgium [PDF]
Vermeulen, Gert, Verrydt, Lynn
core +1 more source
Scaling‐Up of Structural Superlubricity: Challenges and Opportunities
At increasing length‐scales, structural superlubricity (SSL) faces challenges from physical and chemical energy dissipation pathways. This study reviews recent experimental and theoretical progress on these challenges facing the scaling‐up of SSL, as well as perspectives on future directions for realizing and manipulating macroscale superlubricity ...
Penghua Ying+4 more
wiley +1 more source
Ovarian squamous cell carcinoma: clinicopathological features, prognosis and immunotherapy outcomes. [PDF]
Zhang T, Yang J, Li S, Shi X, Yang J.
europepmc +1 more source
This study examines the surface characteristics of AlInP (001), crucial for advanced solar cells and photoelectrochemical devices. Using theoretical modeling and experiments, it identifies how phosphorus‐rich and indium‐rich surfaces create mid‐gap states that pin the Fermi level and influence ultrafast electron dynamics.
Mohammad Amin Zare Pour+11 more
wiley +1 more source
Carbon Nanotube 3D Integrated Circuits: From Design to Applications
As Moore's law approaches its physical limits, carbon nanotube (CNT) 3D integrated circuits (ICs) emerge as a promising alternative due to the miniaturization, high mobility, and low power consumption. CNT 3D ICs in optoelectronics, memory, and monolithic ICs are reviewed while addressing challenges in fabrication, design, and integration.
Han‐Yang Liu+3 more
wiley +1 more source