Results 261 to 270 of about 3,263,025 (375)

Versatile Selective Soldering via Molten Metal Printing for Heat‐Sensitive 3D Electronics and Smart Wearables

open access: yesAdvanced Functional Materials, EarlyView.
Selective soldering via molten metal printing enables component integration, even in heat‐sensitive applications across fields like additive manufacturing, sustainable electronics, and smart textiles. This method overcomes the temperature limitations of existing technologies.
Dániel Straubinger   +4 more
wiley   +1 more source

Print‐and‐Plate Architected Electrodes for Electrochemical Transformations Under Flow

open access: yesAdvanced Functional Materials, EarlyView.
Typical flow cell electrodes are composed of stochastic porous carbon, limiting understanding of electrode structure‐performance relationships. This work describes an approach, termed “print‐and‐plate,” to prepare porous electrodes by direct ink writing followed by conformal metal coating.
Dylan M. Barber   +12 more
wiley   +1 more source

Unlocking High‐Performance in All‐Organic Solar Cells by the Development of Organic Electrodes with No Acid and High‐Temperature Treatment and the Effective Preparation Thereof on Organic Multilayer Films

open access: yesAdvanced Functional Materials, EarlyView.
The developed all‐organic solar cells achieve a power conversion efficiency of 8.7%, more than double the previous record. In addition, bioplastic substrates are used to produce environmentally friendly solar cells with an efficiency of 8.6%. These results are achieved by developing high‐performance organic electrodes without acid doping or high ...
Keiju Hashida   +12 more
wiley   +1 more source

Predicting 2D Crystal Packing in Thin Films of Small Molecule Organic Materials

open access: yesAdvanced Functional Materials, EarlyView.
A computational method is proposed for predicting the 2D molecular packing in crystalline thin films of flexible organic molecules. The approach employs a grid search for molecular arrangements, achieving accurate predictions of 2D packing motifs with strongly reduced computational costs.
Alexey O. Gudovannyy   +6 more
wiley   +1 more source

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