Recent Progress in Physics-Based Modeling of Electromigration in Integrated Circuit Interconnects. [PDF]
Zhao WS, Zhang R, Wang DW.
europepmc +1 more source
This study presents the BioCLEAR system, a highly transparent and conductive neural electrode array composed of silver nanowires (AgNWs) and doped PEDOT:PSS, enabling neural recordings with minimal optical artifacts. When integrated with a GRIN lens, this cost‐effective neural implant allows simultaneous electrophysiological recording and GCaMP6‐based ...
Dongjun Han +17 more
wiley +1 more source
Laser-written reconfigurable photonic integrated circuit directly coupled to a single-photon avalanche diode array. [PDF]
Gualandi G +10 more
europepmc +1 more source
Generating Defective Epoxy Drop Images for Die Attachment in Integrated Circuit Manufacturing via Enhanced Loss Function CycleGAN. [PDF]
Alam L, Kehtarnavaz N.
europepmc +1 more source
Integrated Circuits and Microsystems for Emerging Biomedical Applications
Minkyu Je
openalex +1 more source
Electroactive Metal–Organic Frameworks for Electrocatalysis
Electrocatalysis is crucial in sustainable energy conversion as it enables efficient chemical transformations. The review discusses how metal–organic frameworks can revolutionize this field by offering tailorable structures and active site tunability, enabling efficient and selective electrocatalytic processes.
Irena Senkovska +7 more
wiley +1 more source
Large-Scale Implementation of Vertical Sidewall and Vertical Multi-Channel WS<sub>2</sub> Nanosheet Field-Effect Transistors for Area-Efficient Integrated Circuit. [PDF]
Ma J, Yang E, Lee C, Seok J, Chang J.
europepmc +1 more source
Photoswitching Conduction in Framework Materials
This mini‐review summarizes recent advances in state‐of‐the‐art proton and electron conduction in framework materials that can be remotely and reversibly switched on and off by light. It discusses the various photoswitching conduction mechanisms and the strategies employed to enhance photoswitched conductivity.
Helmy Pacheco Hernandez +4 more
wiley +1 more source
Compression Molding Flow Behavior and Void Optimization of an Integrated Circuit Package with Shielding-Metal-Frame. [PDF]
Lee TY +4 more
europepmc +1 more source

