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Correction: Hsieh et al. Single-Grain Gate-All-Around Si Nanowire FET Using Low-Thermal-Budget Processes for Monolithic Three-Dimensional Integrated Circuits. <i>Micromachines</i> 2020, <i>11</i>, 741. [PDF]
Hsieh TY +6 more
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Nanoscale Three-Dimensional Imaging of Integrated Circuits Using a Scanning Electron Microscope and Transition-Edge Sensor Spectrometer. [PDF]
Nakamura N +32 more
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MRS Proceedings, 1989
AbstractRecent progress in InP-based photonic integrated circuits (PIC's) is reviewed, with an emphasis on the new level of design complexity and fabrication flexibility afforded by advances in metal-organic-vapor-phase-epitaxy(MOVPE) growth techniques.
T.L. Koch, U. Koren
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AbstractRecent progress in InP-based photonic integrated circuits (PIC's) is reviewed, with an emphasis on the new level of design complexity and fabrication flexibility afforded by advances in metal-organic-vapor-phase-epitaxy(MOVPE) growth techniques.
T.L. Koch, U. Koren
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Telesensor Integrated Circuits
World Journal of Surgery, 2001Progress in personal computing has recently permitted small research programs to design and simulate application‐specific integrated circuits (ASICs). Inexpensive fabrication of silicon chips can then be obtained using chip foundries, and quite complex circuits can be greatly reduced in size with an accompanying increase in certain performance ...
T L, Ferrell +12 more
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2023 International Semiconductor Conference (CAS), 2023
Dale R. Patrick +3 more
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Dale R. Patrick +3 more
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Glioblastoma remodelling of human neural circuits decreases survival
Nature, 2023Abrar Choudhury +2 more
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