Results 241 to 250 of about 525,094 (298)

Trap‐Modified Inverted Organic Photodetectors via Layer‐by‐Layer Processing with Poly(N‐vinylcarbazole) Additives

Advanced Functional Materials, EarlyView.
Trap state engineering in inverted organic photodetectors (OPDs) is achieved via combined layer‐by‐layer (LbL) processing and poly(N‐vinylcarbazole) (PVK) incorporation. LbL reduces the trap density while PVK additives gradually shift trap states from shallow band‐edge to deep mid‐gap levels, tailoring the energy distribution.
Jingwei Yi, Yi Yang, Yusen Pei, Apurva Gadikar, Vahid Mahdikhah, Myratgeldi Kotyrov, Seung Hyun Kim, Kenan Gundogdu, Wei You, Harald Ade, Franky So   +10 more
wiley   +1 more source

Nanoscale Three-Dimensional Imaging of Integrated Circuits Using a Scanning Electron Microscope and Transition-Edge Sensor Spectrometer. [PDF]

Sensors (Basel)
Nakamura N, Szypryt P, Dagel AL, Alpert BK, Bennett DA, Doriese WB, Durkin M, Fowler JW, Fox DT, Gard JD, Goodner RN, Harris JZ, Hilton GC, Jimenez ES, Kernen BL, Larson KW, Levine ZH, McArthur D, Morgan KM, O'Neil GC, Ortiz NJ, Pappas CG, Reintsema CD, Schmidt DR, Schultz PA, Thompson KR, Ullom JN, Vale L, Vaughan CT, Walker C, Weber JC, Wheeler JW, Swetz DS.   +32 more
europepmc   +1 more source

A Study on the Frequency-Domain Black-Box Modeling Method for the Nonlinear Behavioral Level Conduction Immunity of Integrated Circuits Based on X-Parameter Theory. [PDF]

Micromachines (Basel)
Chen X, Xie S, Wei M, Yang Y.
europepmc   +1 more source

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Photonic Integrated Circuits

MRS Proceedings, 1989
AbstractRecent progress in InP-based photonic integrated circuits (PIC's) is reviewed, with an emphasis on the new level of design complexity and fabrication flexibility afforded by advances in metal-organic-vapor-phase-epitaxy(MOVPE) growth techniques.
T.L. Koch, U. Koren
openaire   +1 more source

Telesensor Integrated Circuits

World Journal of Surgery, 2001
Progress in personal computing has recently permitted small research programs to design and simulate application‐specific integrated circuits (ASICs). Inexpensive fabrication of silicon chips can then be obtained using chip foundries, and quite complex circuits can be greatly reduced in size with an accompanying increase in certain performance ...
T L, Ferrell, C L, Britton, W L, Bryan, L G, Clonts, M S, Emery, M N, Ericson, F, Merraudeau, G W, Morrison, A, Passian, S F, Smith, T D, Threatt, G W, Turner, A L, Wintenberg   +12 more
openaire   +2 more sources

Integrated circuits � Three dimensional integrated circuits

2019
  +8 more sources

Integrated Circuits

2023 International Semiconductor Conference (CAS), 2023
Dale R. Patrick, Stephen W. Fardo, Ray E. Richardson, Vigyan (Vigs) Chandra   +3 more
openaire   +2 more sources

Semiconductor devices. Integrated circuits. Digital integrated circuits

2013
  +4 more sources

Integrated Circuits

1976
J.E. FISHER, H.B. GATLAND
  +4 more sources

Programmable photonic circuits

Nature, 2020
Wim Bogaerts, Jose Capmany, David A B Miller   +2 more
exaly