Results 111 to 120 of about 608,841 (219)

Fabrication Routes for Ionic Conducting Fiber Strain Sensors

Advanced Engineering Materials, EarlyView.
Ionic conducting fiber strain sensors (ICFSs) offer compliant, textile‐integrable sensing. Thus far, the commercialization of ICFSs has been constrained by fiber fabrication routes. This review provides a fabrication‐centric analysis of ICFSs correlating processing strategies with material properties and scalability.
Leo John Kershaw, Zhanhong Yang, Anne Ladegaard Skov, Magdalena Skowyra   +3 more
wiley   +1 more source

From Intensive Care Unit Prediction to Intensive Care Unit Accountability: A Global Readiness Passport for Machine-learning Prognostication. [PDF]

Indian J Crit Care Med
Vijayasimha M, Srikanth M, Kaur R, Thukral B, Malini KP, Kaur S.   +5 more
europepmc   +1 more source

Morphology, Transport, and Dynamics of Protein Adsorption in Open‐Cell Metal Foam

Advanced Engineering Materials, EarlyView.
Stainless steel (SS) open‐cell foams are shown to adsorb more protein per unit area than previously reported 316L SS and chromium oxide surfaces under static and flow conditions. An integrated approach combining 3D pore imaging, flow simulation, and protein adsorption experiments characterizes the foam’s performance.
Chinmaya Prerana Inguva, Joseph Lavoie, Afsaneh Rabiei   +2 more
wiley   +1 more source

Parents' Views on Family Care at a Neonatal Intensive Care Unit - A Qualitative Study. [PDF]

Scand J Caring Sci
Larsen LG, Herling SF, Beck SA, Brødsgaard A, Latour JM, Stenkjaer RL.   +5 more
europepmc   +1 more source

High‐Entropy Alloy Interlayers Toward Advanced Joining for High‐Performance Structural Applications: Current Progress and Emerging Challenges

Advanced Engineering Materials, EarlyView.
HEA interlayers offer a versatile route for joining high‐performance structural materials. Their compositional and structural design regulates interfacial reactions, suppresses brittle IMCs, and improves metallurgical bonding. Sandwich interlayers further integrate defect healing with precipitation strengthening, enabling improved strength–ductility ...
Lin Yuan, Jiafen Song, Jinglong Li, Jiangtao Xiong, Tao Yang   +4 more
wiley   +1 more source

Cryogenic Deformation Behavior of TiAl and Insights Into Embrittlement After High‐Temperature Exposure Combined With Secondary Ion Mass Spectroscopy of Near Surface Chemistry

Advanced Engineering Materials, EarlyView.
Near‐surface deuterium enrichment profiles for different microstructural types of TiAl after exposure at 700 °C in a heavy water‐containing environment. The deuterium levels are significantly higher than expected from natural occurrence, indicating that the heavy water dissociated during the exposure treatment and entered the specimens.
Jonathan D. H. Paul, Alexander Welle, Dirk Matthiessen, Michael Oehring, Fritz Appel, Florian Pyczak   +5 more
wiley   +1 more source

Covert brain complexity in the intensive care unit. [PDF]

Cortex
Fecchio M, Schreier DR, Cambareri MK, Nisticò V, Freeman HJ, Lawrence PK, Bodien YG, Young MJ, Wu O, Edlow BL.   +9 more
europepmc   +1 more source

Microstructural, Mechanical, and Textural Evolution of Dissimilar Combination of Laser‐Welded Maraging Steel and 4340 Steel

Advanced Engineering Materials, EarlyView.
The present work reports the microstructural, mechanical, and texture evolution of a dissimilar combination laser‐welded maraging steel with 4340 steel. This is important for aerospace applications. The demand for dissimilar welding is growing rapidly with the requirement of efficient and durable joints.
Bharat Behl, Yu Dong, Alokesh Pramanik, Tapas Kumar Bandyopadhyay   +3 more
wiley   +1 more source

Post-intensive care unit syndrome: trends and research foci in a bibliometric analysis. [PDF]

Rev Lat Am Enfermagem
Silva NSD, Alves PJP, Melo EMOP, Bernardes RA.   +3 more
europepmc   +1 more source

All‐in‐One Analog AI Hardware: On‐Chip Training and Inference with Conductive‐Metal‐Oxide/HfOx ReRAM Devices

Advanced Functional Materials, EarlyView.
An all‐in‐one analog AI accelerator is presented, enabling on‐chip training, weight retention, and long‐term inference acceleration. It leverages a BEOL‐integrated CMO/HfOx ReRAM array with low‐voltage operation (<1.5 V), multi‐bit capability over 32 states, low programming noise (10 nS), and near‐ideal weight transfer.
Donato Francesco Falcone, Victoria Clerico, Wooseok Choi, Tommaso Stecconi, Folkert Horst, Laura Bégon‐Lours, Matteo Galetta, Antonio La Porta, Nikhil Garg, Fabien Alibart, Bert Jan Offrein, Valeria Bragaglia   +11 more
wiley   +1 more source