Results 11 to 20 of about 258,364 (276)
Mechanical analysis of encapsulated metal interconnects under transversal load [PDF]
Novel insights regarding the ability of encapsulated metal interconnections to deform due to bending are presented. Encapsulated metal interconnections are used as electric conductor or measurement system within a wide range of applications fields, e.g ...
Bossuyt, Frederick +4 more
core +1 more source
Interconnections for Additively Manufactured Hybridized Printed Electronics in Harsh Environments
The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of traditional
Clayton Neff +2 more
doaj +1 more source
Volume holographic interconnections with maximal capacity and minimal cross talk [PDF]
Optical interconnections utilizing volume holography are described. Intrinsic cross-talk effects that limit the number of independent interconnections are identified and analyzed by applying coupled-wave analysis.
Gu, Xiang-guang +2 more
core +1 more source
Network Analysis of the Information’s Dissemination in a Group of Schoolchildren
This publication presents the results of a study about the speed of dissemination of information in a group of schoolchildren. The study was performed by network analysis.
Alexei Altoukhov +4 more
doaj +1 more source
This research aimed to examine the factors that could affect the distribution of jobs accomplishment, which was included the distribution of corporate social media, information technologies competencies, and jobs interconnections. This research used the
Siti Mujanah
doaj +1 more source
Packaging technology enabling flexible optical interconnections [PDF]
This paper reports on the latest trends and results on the integration of optical and opto-electronic devices and interconnections inside flexible carrier materials.
Bosman, Erwin +5 more
core +1 more source
Simulation of Impedance Discontinuities Resulting from Degradation of Interconnections on Printed Circuit Boards [PDF]
Numerical simulation of impedance discontinuities resulting from degradation of interconnections on printed circuit ...
Dipartimento Di Elettronica +7 more
core +2 more sources
Processing-Structure-Protrusion Relationship of 3-D Cu TSVs: Control at the Atomic Scale
A phase-field-crystal model is used to investigate the processing-structure-protrusion relationship of blind Cu through-silicon vias (TSVs) at the atomic scale. A higher temperature results in a larger TSV protrusion.
Jinxin Liu +3 more
doaj +1 more source
Background: The tendons of the flexor hallucis longus (FHL) and flexor digitorum longus (FDL) are commonly utilized in reconstructive foot surgery to address deformities. These tendons intersect on the plantar surface and exhibit varying interconnections
Apurba Patra +6 more
doaj +1 more source
Cross-Border Energy Exchange and Renewable Premiums: The Case of the Iberian System
In 2002, the European Union set a target of 10% electricity interconnection capacity for 2020: a target that has been further extended to 15% by 2030. Cross-border interconnection of regional/national electricity systems will allow the EU to enhance its ...
Juan Manuel Roldan-Fernandez +4 more
doaj +1 more source

