Results 211 to 220 of about 13,762 (298)

A Review on Polymer Bonding Through Interdiffusion and Role of Deformation‐Acceleration

Macromolecular Materials and Engineering, Volume 311, Issue 9, September 2026.
Polymer bonding is reframed through deformation‐induced bonding, an energy‐efficient route that joins polymer films without conventional heat‐intensive or adhesive‐based processing. By comparing established bonding methods with deformation‐induced bonding, this review highlights potential energy and cost savings while identifying opportunities across ...
Ajay Vallabh, John G. Tsavalas
wiley   +1 more source

Two-dimensional gradients in magnetic properties created with direct-write laser annealing. [PDF]

Nat Commun
Riddiford LJ, Brock JA, Murawska K, Wisser J, Huang X, Shepelin NA, Nembach HT, Hrabec A, Heyderman LJ.   +8 more
europepmc   +1 more source

Near 13% Efficient Semitransparent Cu(In,Ga)S2 Solar Cells With Band Gap of 1.6 eV on Transparent Back Contact

Progress in Photovoltaics: Research and Applications, Volume 34, Issue 9, Page 1146-1158, September 2026.
This work demonstrates progress in the development of wide‐bandgap CIGS solar cells featuring a transparent back contact, for the application of top cell in tandem devices. A semitransparent device with a bandgap of 1.6 eV achieved a power conversion efficiency of nearly 13% on an ITO back contact.
Kulwinder Kaur, Arivazhagan Valluvar Oli, Michele Melchiorre, Wolfram Hempel, Wolfram Witte, Jan Keller, Susanne Siebentritt   +6 more
wiley   +1 more source

Interdiffusion Behaviors and Microstructure Recombination Mechanisms of Fe₂TiO₄-CaO and FeTiO₃-CaO Systems During Sintering at 1200 °C. [PDF]

Materials (Basel)
Wang B, Gao J, Wang F, Yu Y, Qi Y.
europepmc   +1 more source

Loss Analysis of Low Bandgap (Ag,Cu)(In,Ga)Se2 Solar Cells for Tandem Applications

Small, Volume 22, Issue 52, 16 September 2026.
A complete loss analysis has been carried out on the state‐of‐the‐art 1.0 eV bandgap (Ag,Cu)(In,Ga)Se2 solar cells, which are of interest for tandem devices. The most significant loss mechanisms are found in the open‐circuit voltage, due to non‐radiative losses in the chalcopyrite absorber, and in the fill factor, caused by space‐charge region ...
Francesco Lodola, Sevan Gharabeiki, Maximilian Krause, Shiro Nishiwaki, Romain Carron, Susanne Siebentritt   +5 more
wiley   +1 more source

Quantum Confinement Effect in a Heteromorphic PbS/SnS₂ Superlattice Grown by Atomic Layer Deposition. [PDF]

ACS Nano
Shin DH, Daqiqshirazi M, Bahrami A, Lehmann S, Wolf D, Lubk A, Wrzesińska-Lashkova A, Vaynzof Y, Haider G, Brumme T, Nielsch K.   +10 more
europepmc   +1 more source

Alteration of X‐Ray Emission Band Spectrum Under Bragg Diffraction

X-Ray Spectrometry, Volume 55, Issue 5, Page 704-711, September/October 2026.
ABSTRACT We use a Zr/Si multilayer presenting a gradient of period to probe the shape of the Si L2,3 emission band (maximum around 92 eV) in and out of Bragg conditions. The sample was prepared by magnetron sputtering and its reflectance measured in the photon energy range of interest with synchrotron radiation.
Philippe Jonnard, Jean‐Michel André, Karine Le Guen, Nawel Temmar, Anthony Boucly, Nicolas Rividi, Wanqiu Bai, Angelo Giglia, Nicola Mahne, Sheng Guo, Jingtao Zhu   +10 more
wiley   +1 more source

Weld Formation Between Polymer Films Prepared at Different Temperatures: Insights from Molecular Dynamics Simulations. [PDF]

Macromolecules
Mugnai ML, Seppala JE, Olmsted PD.
europepmc   +1 more source

Y2O3‐Doped Bi2O3–Y2O3‐Stabilized ZrO2 Composite Ceramic Electrolytes Fabricated by Infiltration

Journal of the American Ceramic Society, Volume 109, Issue 9, September 2026.
To boost the electrical conductivity of solid oxide cell electrolytes, Y2O3–stabilized ZrO2 (YSZ) is mixed with Y2O3–doped Bi2O3 (YDB). Alternative to mixing and co‐sintering of powders, infiltration of liquid YDB precursor into porous YSZ scaffold is proposed.
Selma Nur Büyükgöz, Sorour Semsari Parapari, Sašo Šturm, Mustafa Ünsal Ünver, Aligül Büyükaksoy   +4 more
wiley   +1 more source

Temperature-mediated microstructure evolution and densification mechanism of F2314 fluoropolymer binder during warm isostatic pressing. [PDF]

RSC Adv
Yang B, Yang K, Yang Z, Lv K, Yang H, Li J, Guo S.   +6 more
europepmc   +1 more source