Results 151 to 160 of about 175,535 (378)

Ultra‐Improved Interfacial Strength Between Metallic Surface and Polyurethane via Cost‐Effective Anodizing Process

Advanced Materials Interfaces, EarlyView.
SAA significantly enhanced Al/PU bonding, increasing SLSS by up to 920% and fracture energy by 15 100% through optimized micro‐nano porous surfaces. RSM identified the optimal anodizing conditions, while ML confirmed sulfuric acid concentration and roughness as dominant predictors of strength.
Umut Bakhbergen, Sherif Araby, Zhandos Tauanov, Nursultan Turdakyn, Reza Montazami, Fethi Abbassi, Gulnur Kalimuldina   +6 more
wiley   +1 more source

An Ultrasmall Ordered High-Entropy Intermetallic with Multiple Active Sites for the Oxygen Reduction Reaction

, 2023
Tao Chen, Chunyu Qiu, Xinkai Zhang, Hangchao Wang, Song Jin, Kun Zhang, Tonghuan Yang, Yuxuan Zuo, Yali Yang, Chuan Gao, Wukun Xiao, Zewen Jiang, Yucheng Wang, Yan Xiang, Dingguo Xia   +14 more
openalex   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya, Adamos Christou, Sihang Ma, Ravinder Dahiya   +3 more
wiley   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

Advanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz, Yaroslav Mudryk, Jun Cui, Lucas Griffith, Duane D. Johnson, Julie Slaughter   +5 more
wiley   +1 more source

Laser‐Based Solidification of Cermets/Cemented Carbides: Processing‐Microstructure‐Property Relationships

Advanced Materials Technologies, EarlyView.
Recent research on laser‐processed cermets and cemented carbides highlights significant advancements, yet a notable paucity of studies and persistent challenges remain. Efforts are increasingly focused on developing low‐cost, environmentally friendly cermets as alternatives to conventional materials.
Himanshu Singh Maurya, Farid Akhtar, Konda Gokuldoss Prashanth   +2 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

Advanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal, Davey Boss, René H. Poelma, Elias Vlieg, John J. Schermer   +4 more
wiley   +1 more source

Laser Micromachining of Liquid Metal Patterns for Stretchable Electronic Circuits

Advanced Materials Technologies, EarlyView.
A cleanroom‐free fabrication strategy combines UV‐laser micromachining with a copper foil wetting layer to rapidly produce high resolution, liquid metal based stretchable electronic circuits on diverse substrates. The scalable, maskless process enables complex circuit designs (<$<$3 h, ∼$\sim$15/device) with excellent electrical stability under strain,
Merjen Palvanova, Patrick McManigal, Grace Fredrickson, Eric J. Markvicka   +3 more
wiley   +1 more source

Palladium Zinc Nanocrystals: Nanoscale Amalgamation Enables Multifunctional Intermetallic Colloids [PDF]

, 2023
Olesya Yarema, A. Moser, Chun‐Wei Chang, Jasper Clarysse, Florian M. Schenk, Eda Egüz, Hanut Vemulapalli, Neeru Mittal, Eldho Edison, Yi‐Hsuan Wu, Denis A. Kuznetsov, Christoph R. Müller, Markus Niederberger, Christian M. Franck, Vanessa Wood, Maksym Yarema   +15 more
openalex   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

Advanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack, Lennert Purnal, Parth Vinayakrao Sewlikar, Sam Cuyvers, Gus Geurts, Rathul Nengminza Sangma, Derese Desta, Dieter Reenaers, Bart Ruttens, Iris De Graeve, Tom Hauffman, Seppe Terryn, Bram Vanderborght, Michaël Daenen, Wim Deferme, Monika Rai   +15 more
wiley   +1 more source

In-situ refractory intermetallic-based composites

, 1995
Dilip M. Shah, Donald L. Anton, D. P. Pope, Stephen Chin   +3 more
openalex   +1 more source