Results 171 to 180 of about 97,964 (282)

Structural instabilities in rare earth intermetallic compounds with CsCl structure [PDF]

, 1979
B. Lüthi, R.L. Sommer, P. Morin
openalex   +1 more source

Improved Direct Ink Writing of Liquid Metal Foams via Liquid Additives

Advanced Electronic Materials, EarlyView.
The ability to pattern liquid metal is useful for making soft electrical and thermal devices. Dispensing liquid metal from a nozzle naturally results in the formation of spheroidal droplets, making direct‐write printing challenging. Liquid metal foams containing pockets of air can extrude as filaments, albeit inconsistently.
Febby Krisnadi, Tushar Sakorikar, Man Hou Vong, Michael D. Dickey   +3 more
wiley   +1 more source

Intermetallic diffusion in gold-lead systems

, 1960
A. Ascoli, E. Germagnoli
openalex   +2 more sources

Shaping Magnetic Liquid Metals Into 3D Leakage‐Free, Shape‐Programmable Structures and Electronics

Advanced Electronic Materials, EarlyView.
This research addresses the fluidity‐induced leakage challenge in the 3D patterning of liquid metals (LMs) by utilizing magnetic liquid metals (MLMs). These 3D MLM structures prevent LM leakage, enable shape programmability and reconfigurability, and exhibit self‐healing and enhanced compression resistance.
Yongyu Lu, Zizheng Wang, Vagif Abdulla, Jacob Pfund, Shao‐Hao Lu, Yi Li, Xincheng Zhang, Gavin Fennell, Yuxuan Zhang, Menka Jain, Yi Zhang, Xueju Wang   +11 more
wiley   +1 more source

A nuclear magnetic resonance investigation of intermetallic compounds of yttrium with iron group metals

, 1963
S. L. Segel
openalex   +1 more source

Effect of Added Ni Nanoparticles on the Microstructure and Mechanical Properties of Sn58Bi/Cu Solder Joints under Thermal Shock Conditions

Advanced Electronic Materials, EarlyView.
This article concludes that the microstructure as well as grain coarsening is suppressed and the growth of IMC layer is promoted in Sn58Bi/Cu solder joints versus Sn58Bi‐0.6 Ni/Cu solder joints after 1200 thermal shock experiments, while the mechanical properties of the solder joints are improved.
Jiamin Zhang, Liang Zhang, Yuhao Chen, Weimin Long, Yunxin Liu   +4 more
wiley   +1 more source

Cohesion in the intermetallic series Mg2Si, Mg2Ge, Mg2Sn, and Mg2Pb

, 1962
Henry John Caulfield
openalex   +1 more source

Advances in MXene‐Based Electronics via Surface and Structural Redesigning and Beyond

Advanced Electronic Materials, EarlyView.
Herein, various MXenes surface and structural engineering strategies such as termination control, doping, interlayer design, and heterostructures are reviewed for advanced electronics applications. We discuss how these approaches optimize conductivity, work function, and device integration, enabling breakthroughs in transistors, photodetectors, and ...
Adnan Younis, Edvin Idrisov, Saleh Thaker, Fathalla Hamed, El Hadi Sadki, Muhammad Zafar Iqbal, Tariq Mahmood, Babar Shabbir, Qiaoliang Bao   +8 more
wiley   +1 more source

DETERMINATION OF THE ORDERING IN THE INTERMETALLIC COMPOUND Ag$sub 2$AL BY MEANS OF X RAYS (thesis)

, 1965
J. Neumann
openalex   +2 more sources

Integrating Automated Electrochemistry and High‐Throughput Characterization with Machine Learning to Explore Si─Ge─Sn Thin‐Film Lithium Battery Anodes

Advanced Energy Materials, Volume 15, Issue 11, March 18, 2025.
A closed‐loop, data‐driven approach facilitates the exploration of high‐performance Si─Ge─Sn alloys as promising fast‐charging battery anodes. Autonomous electrochemical experimentation using a scanning droplet cell is combined with real‐time optimization to efficiently navigate composition space.
Alexey Sanin, Jackson K. Flowers, Tobias H. Piotrowiak, Frederic Felsen, Leon Merker, Alfred Ludwig, Dominic Bresser, Helge Sören Stein   +7 more
wiley   +1 more source