Results 21 to 30 of about 11,226 (306)
A study on the effect of ageing and intermetallic compound growth on the shear strength of surface mount technology solder joints [PDF]
The effect of ageing and intermetallic compound formation on the surface mount solder joints and its shear strength behavior under extreme mechanical and thermal conditions have been discussed in this paper.
Nath, Jyotishman +3 more
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Influence of PCB Surface Finishes on Intermetallic Compound Growth [PDF]
This article presents research focused on the intermetallic compound growing under different conditions. The quality of solder joints depends on many factors, one of which is the thickness of the intermetallic layer and its composition.
Steiner, František +2 more
core +1 more source
The intermetallic compound Mg21Zn25 [PDF]
The crystal structure of the intermetallic compound henicosa-magnesium pentacosazinc, Mg21Zn25, has been determined by single-crystal X-ray diffraction.
Renaudin, Guillaume +3 more
core +1 more source
Intermetallic compounds are becoming hot materials as catalysts because they show unique catalytic properties that originate from a unique electronic structure and an atomic ordered surface.
Takayuki Kojima +2 more
doaj +1 more source
The synthesis of highly ordered intermetallic compound catalysts remains a challenge owing to the limited understanding of their formation mechanism under high-temperature conditions.
Wei-Jie Zeng +5 more
doaj +1 more source
In this work, Ti/Al and Ti/Ni metal intermetallic laminates (MILs) prepared by diffusion bonding are compared based on the intermetallic phases formed, specific strength and density.
Nagarajan Thiyaneshwaran +4 more
doaj +1 more source
Large positive magnetoresistance in intermetallic compound NdCo2Si2 [PDF]
The magnetic, magneto-transport and magnetocaloric properties of antiferromagnetic intermetallic compound NdCo2Si2 (T-N = 32 K) have been studied. The compound yields a positive magnetoresistance (MR) of about similar to 123% at similar to 5 K in 8 T ...
BANDYOPADHYAY, B +4 more
core +1 more source
A Study of the Intermetallic Compound Growth in Flip-Chip Packages under Thermal Loading [PDF]
The intermetallic compound layers in solder bumps have the brittle feature and can easily fracture under thermal or mechanical loading. Therefore, the intermetallic compound is an issue for the fracture reliability of the solder bumps. In this work,
Xu, C., Zhong, Z.W., Choi, W.K.
core +2 more sources
Evaluation of dissimilar 7075 aluminum/AISI 304 stainless steel joints using friction stir welding
Friction stir welding of dissimilar 7075 aluminum/AISI 304 stainless steel joints was done using different tool rotational speed values. The weld was mainly formed in the aluminum part due to the offset value, and stainless steel particles were ...
E. Joshani +3 more
doaj +1 more source
Study on Long - Term Hot Dipping Behavior of 316L Stainless Steel in Zn - 5%Al Alloy Melt [PDF]
With the aim of researching the long - term hot dipping behavior of 316L stainless steel in Zn - 5% (mass fraction, the same below) Al alloy melt at 450 ℃, the formation and growth rules of intermetallic compounds at the interface between Zn - Al alloy ...
WANG Banglin, LIAO Xingli, KE Yongjun, LU Chenghong, YAN Caimin, LAI Delin, CENG Faming, CHE Chunshan
doaj +1 more source

