Advanced Science, EarlyView.The study proposes a universal strategy for the synthesis of high‐performance vanadium‐based PBAs (V‐PBAs) cathodes for aluminum ion batteries. It is find that the doped transition metals (Fe/Co/Ni) at carbon‐coordinated sites can markedly enhance the multi‐electron redox activity and inhibit the V dissolution, structural collapse, and other ...
Wanchang Feng +14 more
wiley +1 more source
Effect of adding ZrM (M=Fe, Ni) intermetallic compounds on the hydrogen absorption/desorption properties of TiCr1.1V0.9 alloy. [PDF]
Heliyon, 2022 Martínez-Amariz A, Bellon D.
europepmc +1 more source
Examinations on Electrolytic Conditions for Isolating and Etching Intermetallic Compounds in Alloys
, 1967 Yûnoshin Imai +2 more
openalex +2 more sources
Low‐Frequency Microwave Absorption Composites
Advanced Science, EarlyView.The microwave absorption principles and low‐frequency performance factors are briefly introduced. Recent progress is systematically summarized in five different based composites. Then detailed analysis focuses on relationships and mechanisms about micro‐structure and macro‐performance.
Mukun He +7 more
wiley +1 more source
Formation and Growth of Intermetallic Compounds during Reactions between Liquid Gallium and Solid Nickel. [PDF]
Materials (Basel), 2021 Lee D, Kim CL, Sohn Y.
europepmc +1 more source
Diffusion in intermetallic compounds with the CaF2 structure: A marker study of the formation of NiSi2 thin films [PDF]
, 1982 F. M. d’Heurle +3 more
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Improved Direct Ink Writing of Liquid Metal Foams via Liquid Additives
Advanced Electronic Materials, EarlyView.The ability to pattern liquid metal is useful for making soft electrical and thermal devices. Dispensing liquid metal from a nozzle naturally results in the formation of spheroidal droplets, making direct‐write printing challenging. Liquid metal foams containing pockets of air can extrude as filaments, albeit inconsistently.
Febby Krisnadi +3 more
wiley +1 more source
A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging
Journal of Materials Research and TechnologyCopper pillar bumps are widely utilized in advanced packaging technologies, representing a crucial foundation for 3D packaging. However, the mechanical properties of Sn3Ag bumps on copper columns often fall short of meeting increasingly demanding service
JinTao Wang +10 more
doaj
Microstructure and Optical Properties of Nanostructural Thin Films Fabricated through Oxidation of Au-Sn Intermetallic Compounds. [PDF]
Materials (Basel), 2021 Skowronski L +3 more
europepmc +1 more source