Results 71 to 80 of about 7,266 (261)

Atomistic Mechanisms Triggered by Joule Heating Effects in Metallic Cu‐Bi Nanowires for Spintronics

open access: yesAdvanced Materials, EarlyView.
Bi doped metallic Cu nanowires are promising for spintronics thanks to the stabilization of a giant spin Hall effect. However, heat resulting from current injection forces Bi to leave solution, forcing segregation into monoatomic decorations which evolve into coherent crystalline aggregates.
Alejandra Guedeja‐Marrón   +6 more
wiley   +1 more source

Intermetallic compounds of gold [PDF]

open access: yesGold Bulletin, 1996
The publication of a treatise (1) and two recent papers (2, 3) on the attributes and applications of intermetallic compounds (IMCs) generally make it appropriate to summarize some facts relating to the IMCs of gold.
openaire   +1 more source

In Situ Amine Formation to Modulate MOF‐Derived PdIn N‐Doped Carbon Catalysts

open access: yesAdvanced Materials, EarlyView.
An amine‐assisted approach converts PdIn‐MOF into PdIn intermetallic nanoparticles embedded in N‐doped carbon. In situ‐generated amines trigger early Pd nucleation, producing smaller PdIn domains than direct pyrolysis. Amine sterics and basicity tune composition and particle size, while solvent and amine co‐determine textural features.
Gonzalo Egea   +9 more
wiley   +1 more source

Investigating Formation of Intermetallics in Compound Casting of Al/Cu Bimetals

open access: yesJournal of Advanced Materials in Engineering, 2016
The purpose of this article is to study the formation of intermetallic compounds (IMCs) at the interface of Al/Cu bimetal produced by compound casting of molten Al in solid copper tubes.
S. Tavassoli, M. Abbasi, R. Tahavvori
doaj   +2 more sources

Electrochemical Performance of Fe-Al intermetallic alloys with addition of Li, Ni and Ce in NaVO3 at 700°C

open access: yesInternational Journal of Electrochemical Science, 2013
Potentiodynamic polarization curves and polarization resistance measurements were used to study the hot corrosion behavior of two intermetallic compounds, i.e., FeAl and Fe3Al with minor additions of Ni, Ce and Li exposed in a NaVO3 salt at 700°C.
A. Luna-Ramirez   +5 more
doaj   +1 more source

Alloys and Intermetallic Compounds

open access: yes, 2017
This book focuses on the role of modeling in the design of alloys and intermetallic compounds. It includes an introduction to the most important and most used modeling techniques, such as CALPHAD and ab-initio methods, as well as a section devoted to the latest developments in applications of alloys. The book emphasizes the correlation between modeling
openaire   +2 more sources

Pulsed Laser‐Assisted Phase Engineering of Multimetallic Colloidal Nanocrystals With Complex Compositions

open access: yesAdvanced Materials, EarlyView.
The engineering of colloidal nanocrystals with complex compositions has emerged as a highly active area of research within nanomaterials science. This review covers key aspects of colloidal solid‐solution nanocrystal formation using pulsed laser irradiation.
Marina T. Candela   +4 more
wiley   +1 more source

Effects of Main Alloying Elements on Interface Reaction between Tool Steel and Molten Aluminum [PDF]

open access: yesArchives of Metallurgy and Materials
Effects of Si and Mg as main elements on interface reaction between tool steel and molten Al alloy at 700°C were investigated. Pure aluminum and Al-10mass%Mg alloy showed relatively simple interfacial layers, whereas thicker, multi-layered reaction bonds
Young-Ok Yoon   +5 more
doaj   +1 more source

Recent Progress in the Phase‐Controlled Synthesis of Ruthenium Nanocrystals for Catalytic Applications

open access: yesAdvanced Materials, EarlyView.
Template effect and kinetic control enable crystal‐phase engineering of Ru nanocrystals, granting access to either metastable fcc‐Ru or stable hcp‐Ru with distinct surface structures, thermal stabilities, and catalytic behaviors. Moreover, the hcp‐Ru can further serve as an epitaxial template to direct Pd and Rh nanocrystals into the metastable hcp ...
Jianlong He   +3 more
wiley   +1 more source

A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging

open access: yesJournal of Materials Research and Technology
Copper pillar bumps are widely utilized in advanced packaging technologies, representing a crucial foundation for 3D packaging. However, the mechanical properties of Sn3Ag bumps on copper columns often fall short of meeting increasingly demanding service
JinTao Wang   +10 more
doaj   +1 more source

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