Results 11 to 20 of about 18,073 (192)

Revealing Tendencies in the Electronic Structures of Polar Intermetallic Compounds

Crystals, 2018
The quest for solid-state materials with tailored chemical and physical features stimulates the search for general prescriptions to recognize and forecast their electronic structures providing valuable information about the experimentally determined bulk
Fabian C. Gladisch, Simon Steinberg
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A new insight on the diffusion growth mechanism of intermetallic compounds in Al-Er system

Materials & Design, 2022
The diffusion growth of intermetallic compounds in Al-Er alloys are closely related to the properties of the alloys. The current work aims at explaining the dominance of Al3Er in the Al-Er alloys precipitation phases and the interface thin layer ...
Zhichao Tang, Jin Cui, Muzhi Yu, Weiqiang Zhu, Zhengbing Xu, Jianmin Zeng, Tao Xu, Haodong Yang, Yapeng Tan, Bo Yang   +9 more
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An innovative joint interface design for reducing intermetallic compounds and improving joint strength of thick plate friction stir welded Al/Mg joints

Journal of Magnesium and Alloys, 2023
Friction stir welding of dissimilar Al/Mg thick plates still faces severe challenges, such as poor formability, formation of thick intermetallic compounds, and low joint strength. In this work, two joint configurations, namely inclined butt (conventional
Yang Xu, Liming Ke, Yuqing Mao, Jifeng Sun, Yaxiong Duan, Limin Yu   +5 more
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Auxetic properties of some intermetallic compounds

Фізика і хімія твердого тіла, 2022
With the application of a linear theory of elasticity of anisotropic crystals and the use of experimental values of elastic moduli Сij and compliances Sij given in the Landolt-Börstein tables, characteristic surfaces of Young's moduli, angular ...
M. Raransky, A. Oliinych-Lysiuk, R. Tashchuk, A. Tashchuk, A. Struk, M. Unguryan   +5 more
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Screening of Ternary Intermetallic Catalysts Is Possible Using Metallurgical Synthesis: Demonstration on Heusler Alloys

KONA Powder and Particle Journal, 2020
Intermetallic compounds are becoming hot materials as catalysts because they show unique catalytic properties that originate from a unique electronic structure and an atomic ordered surface.
Takayuki Kojima, Satoshi Kameoka, An-Pang Tsai   +2 more
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OBTAINING INTERMETALLIC COMPOUNDS IN Al–Ti–Zn SYSTEM

Записки Горного института, 2018
Binary intermetallic compounds – titanium aluminides (TiAl, Ti3Al) – when added to the alloys, significantly increase their strength and special properties. The most promising direction to produce intermetallic compounds are mechanochemical technologies,
V. V. Kaminskii, S. A. Petrovich, V. A. Lipin   +2 more
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Electrodeposition of alloys or compounds in molten salts and applications [PDF]

Journal of Mining and Metallurgy. Section B: Metallurgy, 2003
This article deals with the different modes of preparation of alloys or intermetallic compounds using the electrodeposition in molten salts, more particularly molten alkali fluorides.
Taxil P., Chamelot P., Massot L., Hamel C.   +3 more
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Gold‐Aluminium Intermetallic Compound Formation [PDF]

Active and Passive Electronic Components, 1980
During investigations of failure mechanisms and failure avoidance we have studied the kinetics and the mechanisms responsible for the growth of the Au‐Al compounds. Au4Al, Au5Al2, Au2Al, AuAl, AuAl2 have been observed and the growth kinetics of the Au2Al, AuAl, AuAl2 follow a (time)1/2 dependence.
C. Nobili, G. Majni, E. Galli, G. Ottaviani   +3 more
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Manufacturing process of particle intermetallic compound reinforced Al base composites by infiltration-reaction method

Mechanical Engineering Journal, 2016
A new process is proposed to fabricate an aluminum alloy matrix composite dispersed with intermetallic compound particles by using the reaction between porous nickel and molten aluminum alloy.
Yongbum CHOI, Zhefeng XU, Kenjiro SUGIO, Kazuhiro MATSUGI, Gen SASAKI   +4 more
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Investigation Of Intermetallic Compounds In Sn-Cu-Ni Lead-Free Solders

Archives of Metallurgy and Materials, 2015
Interfacial intermetallic compounds (IMC) play an important role in Sn-Cu lead-free soldering. The size and morphology of the intermetallic compounds formed between the lead-free solder and the Cu substrate have a significant effect on the mechanical ...
Nagy E., Kristaly F., Gyenes A., Gacsi Z.   +3 more
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