Results 51 to 60 of about 18,073 (192)

A Sn3Ag–CoSn3 composite copper pillar bump for three-dimensional packaging

open access: yesJournal of Materials Research and Technology
Copper pillar bumps are widely utilized in advanced packaging technologies, representing a crucial foundation for 3D packaging. However, the mechanical properties of Sn3Ag bumps on copper columns often fall short of meeting increasingly demanding service
JinTao Wang   +10 more
doaj   +1 more source

Effects of Main Alloying Elements on Interface Reaction between Tool Steel and Molten Aluminum [PDF]

open access: yesArchives of Metallurgy and Materials
Effects of Si and Mg as main elements on interface reaction between tool steel and molten Al alloy at 700°C were investigated. Pure aluminum and Al-10mass%Mg alloy showed relatively simple interfacial layers, whereas thicker, multi-layered reaction bonds
Young-Ok Yoon   +5 more
doaj   +1 more source

Stress relief treatment of aluminum/magnesium laminates fabricated by roll bonding technique

open access: yesHeliyon
Roll bonding of aluminum/magnesium laminates combines the good corrosion resistance of aluminum alloys with the beneficial mechanical properties of magnesium alloys. We studied the microstructure of aluminum Al-1051/AZ31 magnesium laminates fabricated by
Masoud Rashidi   +2 more
doaj   +1 more source

Elemental distribution and phase composition of Pd-Gd thin films

open access: yesMaterials & Design
Pd-Gd samples, intended as model of target materials for nuclear physics experiments, were produced via molecular plating followed by coupled reduction.
Xuandong Kou   +7 more
doaj   +1 more source

Superconductivity of non-stoichiometric intermetallic compound NbB2 [PDF]

open access: green, 2008
Monika Mudgel   +3 more
openalex   +1 more source

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