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Intermetallic Bonding for High-Temperature Microelectronics and Microsystems: Solid-Liquid Interdiffusion Bonding [PDF]
, 2018 This chapter is distributed under the terms of the Creative which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited Commons Attribution Licens.Solid-liquid interdiffusion (SLID) bonding ...
Aasmundtveit, Knut Eilif +10 more
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Advanced Materials, EarlyView.Ball‐milling Cu‐based metallic glasses with ceria creates a unique nanostructure where metallic glass particles are wrapped by CeO2 nanoparticles. The intimate integration triggers copper state reorganization during reaction and aging, boosting CO oxidation and COPrOx activity.
Maahin Mirzay‐Shahim +17 more
wiley +1 more source
Advanced Materials, EarlyView.2D α‐Co(OH)2 interleaved with Mo species displays an appealing dual functionality for the production and use of green hydrogen.Mo incorporation greatly benefits the electrochemical behaviour in Oxygen Evolution Reaction for H2 production, while the magnetocaloric response at liquid H2 temperature paves the way for alternative cryogenic refrigerants ...
Daniel Muñoz‐Gil +14 more
wiley +1 more source
Atomistic Mechanisms Triggered by Joule Heating Effects in Metallic Cu‐Bi Nanowires for Spintronics
Advanced Materials, EarlyView.Bi doped metallic Cu nanowires are promising for spintronics thanks to the stabilization of a giant spin Hall effect. However, heat resulting from current injection forces Bi to leave solution, forcing segregation into monoatomic decorations which evolve into coherent crystalline aggregates.
Alejandra Guedeja‐Marrón +6 more
wiley +1 more source
Journal of Magnesium and Alloys, 2019 A 6061 Al coating for AZ31 Mg alloy was prepared by multi-pass friction stir welding (FSW) with different travel speeds. The microstructure, mechanical properties of the interfacial region and the corrosion behavior of the coating were investigated ...
Xiaoming Xiong +6 more
doaj +1 more source
CONTROLLING EMBRITTLEMENT AT GRAIN BOUNDARIES IN INTERMETALLIC COMPOUNDS
, 1988 The present paper first presents some characteristics of structure and electronic (bond) nature for the grain boundary brittleness of the intermetallic compounds.
T. TAKASUGI
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In Situ Amine Formation to Modulate MOF‐Derived PdIn N‐Doped Carbon Catalysts
Advanced Materials, EarlyView.An amine‐assisted approach converts PdIn‐MOF into PdIn intermetallic nanoparticles embedded in N‐doped carbon. In situ‐generated amines trigger early Pd nucleation, producing smaller PdIn domains than direct pyrolysis. Amine sterics and basicity tune composition and particle size, while solvent and amine co‐determine textural features.
Gonzalo Egea +9 more
wiley +1 more source
Oxidation of advanced intermetallic compounds
, 1993 Intermetallic compounds with low densities and high melting temperatures are prime structural material candidates for advanced heat engines. The close link between crystal structure and mechanical properties has led the search for new cubic pseudo-binary
N.S. Bornstein
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Advanced Materials, EarlyView.The engineering of colloidal nanocrystals with complex compositions has emerged as a highly active area of research within nanomaterials science. This review covers key aspects of colloidal solid‐solution nanocrystal formation using pulsed laser irradiation.
Marina T. Candela +4 more
wiley +1 more source
Microstructure and mechanical properties of reactive hot isostatic pressed TiAl powder material
, 1991 Reprint from: O. Izumi (ed.): Proceedings of international symposium on intermetallic compounds - structure and mechanical properties, 1991, p. 947-952Available from TIB Hannover: RA 3251(91/E/60) / FIZ - Fachinformationszzentrum Karlsruhe / TIB ...
Dahms, M. +2 more
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