Results 141 to 150 of about 558,571 (289)

Machine Learning‐Based Design of 3D‐Printable Microneedles for Enhanced Tissue Anchoring with Reduced Tissue Damage

open access: yesAdvanced Engineering Materials, EarlyView.
A machine learning‐driven framework is introduced to optimize 3D‐printable microneedles for enhanced tissue anchoring and reduced insertion damage. The optimized design achieves a 6.0‐fold improvement in pull‐out‐to‐penetration energy ratio over conventional shapes.
Jegyeong Ryu   +5 more
wiley   +1 more source

Laser Remelting of a CrMnFeCoNi High‐Entropy Alloy: Effect of Energy Density on Elemental Segregation

open access: yesAdvanced Engineering Materials, EarlyView.
Laser remelting of a CrMnFeCoNi high‐entropy alloy reveals that optimal chemical homogenization occurs between 30 and 40 J·mm−2. Within this range, elemental segregation is reduced by over 30% compared to the as‐cast state. The study establishes this window as a fast, effective alternative to prolonged annealing for achieving uniform elemental ...
Ajay Talbot   +5 more
wiley   +1 more source

Microcellular Poly (Ethylene‐Co‐Vinyl Acetate)/Lignin Nanocomposites for Soft Ferroelectrets

open access: yesAdvanced Engineering Materials, EarlyView.
Lignin valorization for advanced porous polymer nanocomposites development and an upscaling route for continuous manufacturing of soft ferroelectrets for energy harvesting are studied. This work examines the role of lignin and carbon nanotubes (CNT) in modifying the mechanical, dielectric, and ferroelectret properties of poly (ethylene‐co‐vinyl acetate)
Yuchen Lian   +5 more
wiley   +1 more source

Multimodal Characterization of Sn‐Bi Solder Alloy Solidification Using Synchrotron X‐Ray Microtomography and Energy Dispersive Diffraction

open access: yesAdvanced Engineering Materials, EarlyView.
Real‐time imaging and energy‐dispersive diffraction during solidification of Sn‐Bi alloy interconnect for electronic packaging applications are studied. Sn‐Bi solder alloys have generated significant interest in recent times due to their potential use in electronic packaging.
Amey Luktuke   +3 more
wiley   +1 more source

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