Results 151 to 160 of about 47,653 (229)
Advanced Materials, EarlyView.A synthetic protocol for thermally recyclable poly(amide‐imide) aerogels based on Diels–Alder chemistry is presented. Prepared from furan‐modified poly(amide‐imide) and bismaleimide, these aerogels offer thermal superinsulation and excellent thermo‐mechanical performance.
Yufei Xiong +5 more
wiley +1 more source
Advanced Materials, EarlyView.In this study, how crystallographic anisotropy governs the catalytic process is investigated by comparing the tetragonal L10 and cubic L12 ordered phases in a newly developed PtPdFe ternary intermetallic system. New insights into the fundamental understanding of the ordered Pt‐based ternary intermetallic alloys are introduced, unveiling ...
Muhammad Irfansyah Maulana +10 more
wiley +1 more source
Advanced Materials, EarlyView.Metal‐free carbon catalysts enable the sustainable synthesis of hydrogen peroxide via two‐electron oxygen reduction; however, active site complexity continues to hinder reliable interpretation. This review critiques correlation‐based approaches and highlights the importance of orthogonal experimental designs, standardized catalyst passports ...
Dayu Zhu +3 more
wiley +1 more source
Advanced Materials Interfaces, EarlyView.Metabolic glycoengineering combined with click chemistry efficiently immobilizes clickable factor H (FH)‐binding peptides onto endothelial cell surfaces, creating stable, uniform coatings that recruit FH and enhance resistance to complement‐mediated inflammation.
Jannes Felsch +7 more
wiley +1 more source
Super‐Resolution Microscopy in Tissue Engineering
Advanced Materials Interfaces, EarlyView.Super‐resolution microscopy (SRM) has advanced tissue engineering by providing nanoscale insights into cellular interactions. It reveals detailed cell membrane structures, tracks vesicle and virus entry, and visualizes the cytoskeleton. SRM also improves understanding of cell migration, facilitating tissue regeneration, vascularization, immune ...
Navid Rabiee +2 more
wiley +1 more source
Scalable Programming of LaAlO3/SrTiO3 Interfaces via Ultra‐Low‐Voltage Electron‐Beam Lithography
Advanced Materials Interfaces, EarlyView.Ultra‐low‐voltage electron beam lithography (ULV‐EBL) enables rapid and scalable patterning of LaAlO3/SrTiO3 interfaces into nanowires, barriers, and waveguides that reveal 1D superconductivity, nonlinear current‐voltage response, and ballistic transport.
Dengyu Yang +7 more
wiley +1 more source
Advanced Materials Interfaces, EarlyView.Nanoscale and bulk BiVO4 photoelectrodes are fabricated on SnO2‐based substrates via spin coating from the same precursor solution. Their photoelectrochemical behavior toward glycerol and sulfite oxidation is compared. Nanoscale BiVO4 shows higher photocurrents, attributed to improved charge transport and transfer revealed by impedance analysis ...
Seul‐Yi Lee +6 more
wiley +1 more source
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.This review focuses on the application of synthetic biodegradable microarray patches (MAPs) in sustained drug delivery. Compared to conventional MAPs which release drugs into the skin in an immediate manner, these implantable MAPs release drugs into skin microcirculation gradually as the biodegradable polymers degrade, thus offering sustained release ...
Li Zhao +6 more
wiley +1 more source
A Microfluidic Multiplex Sorter for Strain Development
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.A new multiplex method for high‐throughput screening of yeast strains based on glucoamylase production is presented. Droplets containing single mutant yeast cells are incubated for enzyme production. A sorting platform divides mutants by their high‐ and mid‐activity levels.
Chiara Leal‐Alves +6 more
wiley +1 more source
Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates
Advanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya +3 more
wiley +1 more source