Results 261 to 270 of about 424,562 (307)
Multifractal description of the large-scale structure of the universe
Bernard J. T. Jones+3 more
openalex +1 more source
Ni‐base superalloys produced using additive manufacturing (AM) have a different response to heat treatments when compared to their conventional counterparts. Due to such unpredictability, various alloys with industrial interest are currently overlooked in most prior AM research.
Guilherme Maziero Volpato+6 more
wiley +1 more source
Conformal structure of singularities in some varying fundamental constants bimetric cosmologies. [PDF]
Marosek K, Balcerzak A.
europepmc +1 more source
Additive manufacturing technologies like laser powder‐bed fusion offer great design freedom and individualization of products down to a batch size of one. However, parts fabricated with this technology suffer from poor quality. Acoustic assistance during the build process can minimize these drawbacks.
Oliver Maurer, Dirk Bähre
wiley +1 more source
Polarization-Independent Broadband Infrared Selective Absorber Based on Multilayer Thin Film. [PDF]
Wu S+6 more
europepmc +1 more source
This study presents a 3D representative volume element‐based simulation approach to predict mesoscopic residual stress and strain fields in silicon solid solution‐strengthened ductile cast iron. By modeling phase transformation kinetics with an enhanced Johnson–Mehl–Avrami–Kolmogorov model, the effects of varying cooling rates on residual stresses are ...
Lutz Horbach+6 more
wiley +1 more source
CAS-SFCM: Content-Aware Image Smoothing Based on Fuzzy Clustering with Spatial Information. [PDF]
Antunes-Santos F+3 more
europepmc +1 more source
A multimaterial approach is introduced to improve upon auxetic structures by combining two different polymers into the same reentrant honeycomb structure via additive manufacturing. The deformation behavior as well as the resulting Poisson's ratio are thereby improved significantly.
Alexander Engel+2 more
wiley +1 more source
DP-YOLO: A Lightweight Real-Time Detection Algorithm for Rail Fastener Defects. [PDF]
Chen L, Sun Q, Han Z, Zhai F.
europepmc +1 more source
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan+5 more
wiley +1 more source