Results 21 to 30 of about 530,647 (345)

Substrate‐Free Transfer of Large‐Area Ultra‐Thin Electronics

open access: yesAdvanced Electronic Materials, 2023
Innovation in materials and technologies has promoted the fabrication of thin‐film electronics on substrates previously considered incompatible because of their chemical or mechanical properties.
Hugo De Souza Oliveira   +5 more
doaj   +1 more source

Electron Tomography Shows Molecular Anchoring Within a Layer-by-Layer Film [PDF]

open access: yesJournal of the American Chemical Society, 2008
The layer-by-layer self-assembly of thin films consisting of alternating layers of DNA and bis-urea nanoribbons prevents diffusion of the components within the film and allows the anchoring of biotinylated molecules through molecular recognition in a predetermined layer of the film. Electron tomography demonstrates with nanometer precision the location
Vos, M.R-J.   +8 more
openaire   +4 more sources

Cold cathodes based on carbonic nanostructured layered structures [PDF]

open access: yesTekhnologiya i Konstruirovanie v Elektronnoi Apparature, 2013
The paper describes formation conditions for and the structure of diamond-like materials films used in the manufacture of layered cold cathodes of emission electronics devices.
Belyanin A. F.   +3 more
doaj  

Controlling the oxidation and wettability of liquid metal via femtosecond laser for high-resolution flexible electronics

open access: yesFrontiers in Chemistry, 2022
Liquid metal-based electronic devices are attracting increasing attention owing to their excellent flexibility and high conductivity. However, a simple way to realize liquid metal electronics on a microscale without photolithography is still challenging.
Jingzhou Zhang   +6 more
doaj   +1 more source

Surface morphology of polyimide thin film dip-coated on polyester filament for dielectric layer in fibrous organic field effect transistor [PDF]

open access: yes, 2014
The idea of wearable electronics automatically leads to the concept of integrating electronic functions on textile substrates. Since this substrate type implies certain challenges in comparison with their rigid electronic companions, it is of utmost ...
Bruneel, Els   +3 more
core   +1 more source

Ion traps fabricated in a CMOS foundry [PDF]

open access: yes, 2014
We demonstrate trapping in a surface-electrode ion trap fabricated in a 90-nm CMOS (complementary metal-oxide-semiconductor) foundry process utilizing the top metal layer of the process for the trap electrodes.
A. M. Eltony   +8 more
core   +2 more sources

High Dielectric Breakdown Strength Nanoplatelet‐Based Multilayer Thin Films

open access: yesMacromolecular Materials and Engineering, 2023
Dielectric materials that can withstand high voltages are of great interest due to the growing need for high‐performance insulation systems in electronics. Polymer nanocomposites have gained popularity as electrical insulators due to their processability,
Bethany Palen   +8 more
doaj   +1 more source

Flexible three-dimensional artificial synapse networks with correlated learning and trainable memory capability

open access: yesNature Communications, 2017
High-density information storage calls for the development of modern electronics with multiple stacking architectures that increase the complexity of three-dimensional interconnectivity. Here, Wu et al.
Chaoxing Wu   +4 more
doaj   +1 more source

The Layer 0 Inner Silicon Detector of the D0 Experiment

open access: yes, 2009
This paper describes the design, fabrication, installation and performance of the new inner layer called Layer 0 (L0) that was inserted in the existing Run IIa Silicon Micro-Strip Tracker (SMT) of the D0 experiment at the Fermilab Tevatron collider.
A. Bean   +54 more
core   +1 more source

Electrical Control of Silicon Photonic Crystal Cavity by Graphene [PDF]

open access: yes, 2012
Efficient conversion of electrical signal to optical signal in nano-photonics enables solid state integration of electronics and photonics. Combination of graphene with photonic crystals is promising for electro-optic modulation.
Kim, Jonghwan   +3 more
core   +1 more source

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