Results 191 to 200 of about 104,361 (241)

Shadow‐Free Back‐Contact Perovskite Thin‐Film Detectors for Direct Extreme‐Ultraviolet and Soft X‐Ray Sensing

open access: yesAdvanced Materials Interfaces, EarlyView.
A triple‐cation perovskite detector with a quasi‐interdigitated back‐contact architecture enables highly sensitive and linear EUV/soft x‐ray detection by minimizing electrode shadowing and enhancing charge extraction. Efficient interfacial carrier collection and rapid temporal response highlight the potential of back‐contact‐engineered perovskites for ...
Jingying Liu   +5 more
wiley   +1 more source

From the Discovery of the Giant Magnetocaloric Effect to the Development of High‐Power‐Density Systems

open access: yesAdvanced Materials Technologies, EarlyView.
The article overviews past and current efforts on caloric materials and systems, highlighting the contributions of Ames National Laboratory to the field. Solid‐state caloric heat pumping is an innovative method that can be implemented in a wide range of cooling and heating applications.
Agata Czernuszewicz   +5 more
wiley   +1 more source

Exploring the Potential of Microwave Annealing for Enhancing Si‐based GeSn Lasers

open access: yesAdvanced Materials Technologies, EarlyView.
We explore low‐thermal‐budget microwave annealing to enhance the performance of group‐IV GeSn lasers on Si. Microwave annealing under optimal conditions can simultaneously relax unwanted compressive strain and enhance the material quality of the GeSn active layer, thereby reducing the threshold and increasing the laser operating temperature.
Yue‐Tong Jheng   +8 more
wiley   +1 more source

Micropillar‐Engineered Hybrid Adhesive Patch for Surface‐Conformable and Directional Adhesion

open access: yesAdvanced Materials Technologies, EarlyView.
This work presents a surface‐conformable hybrid adhesive integrating height‐optimized hexagonal micropillars with open‐rectangular cuts. The micropillars enhance rough‐surface contact and microscale crack arrest, while the cuts guide and reverse interfacial cracks for strong and directional adhesion. The multiscale architecture achieves robust pull‐off
Seongjin Park   +4 more
wiley   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack   +15 more
wiley   +1 more source

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