Results 311 to 320 of about 87,767 (354)

Prognostic analysis of defects in manufacturing

Industrial Management and Data Systems, 2015
Purpose – Since works-in-process (WIPs) are highly vulnerable to defects because of the variety and complexity of manufacturing processes, the purpose of this paper is to describe how to utilize existing analytics techniques to reduce defects, improve production processes, and reduce the cost of operations.
Jongsawas Chongwatpol
exaly   +2 more sources

Automatic defect classification for semiconductor manufacturing

Machine Vision and Applications, 1997
Visual defect inspection and classification are important parts of most manufacturing processes in the semiconductor and electronics industries. Defect classification provides relevant information to correct process problems, thereby enhancing the yield and quality of the product.
Paul B. Chou, A. Ravishankar Rao, Martin C. Sturzenbecker, Frederick Y. Wu, Virginia H. Brecher   +4 more
openaire   +1 more source

Manufacturing Or Production Defects And Design Defects

2020
Abstract There are generally few difficulties in applying the consumer expectation test of s 3(1) of the 1987 Act to manufacturing or production defects. Thus it can be said that: ‘persons generally are clearly entitled to expect that a product conform with the standard of safety common to the items of a same line of products marketed by
Duncan Fairgrieve, Richard Goldberg
openaire   +1 more source

Online detection of defects in layered manufacturing

Proceedings. 1998 IEEE International Conference on Robotics and Automation (Cat. No.98CH36146), 2002
Layered manufacturing is an additive manufacturing process where the parts are built layer by layer based on the geometry provided by a CAD system. There are several different technologies for layered manufacturing. We focus on fused deposition of ceramics.
Tong Fang, Izzat Bakhadyrov, Mohsen A. Jafari, Gülgün Alpan   +3 more
openaire   +1 more source

Defect detection in indirect layered manufacturing

SMC'98 Conference Proceedings. 1998 IEEE International Conference on Systems, Man, and Cybernetics (Cat. No.98CH36218), 2002
Direct layered manufacturing (LM) is an additive manufacturing process where part is built layer by layer based on its CAD file. Indirect LM is a process where mold for a part is built by direct LM process. In this work we demonstrate a machine vision setup for surface voids detection which can be used for surface quality inspection of parts built by ...
Izzat Bakhadyrov, Mohsen A. Jafari, Tong Fang, Ahmad Safari, Stephen C. Danforth, Noshir A. Langrana   +5 more
openaire   +1 more source

Defect Status in SiC Manufacturing

Materials Science Forum, 2009
Availability of high-quality, large diameter SiC wafers in quantity has bolstered the commercial application of and interest in both SiC- and nitride-based device technologies. Successful development of SiC devices requires low defect densities, which have been achieved only through significant advances in substrate and epitaxial layer quality.
Elif Berkman, R.T. Leonard, Michael J. Paisley, Y. Khlebnikov, Michael J. O'Loughlin, Albert A. Burk, Adrian R. Powell, D.P. Malta, E. Deyneka, M.F. Brady, I. Khlebnikov, Valeri F. Tsvetkov, H.McD. Hobgood, Joseph J. Sumakeris, C. Basceri, Vijay Balakrishna, Calvin H. Carter Jr., C. Balkas   +17 more
openaire   +1 more source

Simulation of the geometrical defects of manufacturing

The International Journal of Advanced Manufacturing Technology, 2009
The complexity of a multi-stage machining process makes it very difficult to assess process plans, from a geometrical point of view. Today, repeated trial runs or very simple simulations are the methods applied to assess a process plan before production release.
Kamali Nejad, Mojtaba, Vignat, Frédéric, Villeneuve, François   +2 more
openaire   +1 more source

Defect-free manufacturing in the nineties

Proceedings of the IEEE 1991 National Aerospace and Electronics Conference NAECON 1991, 2002
Some techniques for defect-free manufacturing for the 1990s are presented, along with case histories. Particular attention is given to such techniques as process failure modes and effects analysis, fault-tree analysis, and process analysis mappings. >
D.G. Raheja, M.L. Lindsley
openaire   +1 more source

Defect Detection in Wire Manufacturing

1999
In the sequential drawing of metallic wires from an initial diameter of 196 mils (4.9 mm) to a final diameter just under 1 mil (25 μm), the wires sometimes break. Subsequent examination via TEM of broken Al wires [1] revealed that breaks occurred most often due to inclusions of Si almost as large as the wire diameter.
H. Weinstock, N. Tralshawala, J. R. Claycomb, T. J. Shaw, J. Clarke   +4 more
openaire   +2 more sources