Results 241 to 250 of about 409,525 (333)

Ultra‐Improved Interfacial Strength Between Metallic Surface and Polyurethane via Cost‐Effective Anodizing Process

open access: yesAdvanced Materials Interfaces, EarlyView.
SAA significantly enhanced Al/PU bonding, increasing SLSS by up to 920% and fracture energy by 15 100% through optimized micro‐nano porous surfaces. RSM identified the optimal anodizing conditions, while ML confirmed sulfuric acid concentration and roughness as dominant predictors of strength.
Umut Bakhbergen   +6 more
wiley   +1 more source

Printed Interconnects for Heterogeneous Systems Integration on Flexible Substrates

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
Key components (sensors, energy devices, communication devices, computing chips, and interconnects) of flexible hybrid electronic (FHE) system connected via conductive printed metal tracks. The figure in the insets shows out‐of‐plane printed interconnects providing opportunities for lithography‐free formation of VIAs, in‐plane access of UTCs pads, and ...
Abhishek Singh Dahiya   +3 more
wiley   +1 more source

Photonic Crystal Enhanced Microscopy on a 2D Photonic Crystal Surface

open access: yesAdvanced Materials Technologies, Volume 10, Issue 6, March 18, 2025.
This work demonstrates the design, fabrication, and the first‐time test of a 2D photonic crystal surface for photonic resonator absorption microscopy. The designed surface uniformly enhances electromagnetic near fields, achieving > 100% improved detecting uniformity for surface‐captured AuNPs from a blocking biosensor assay aimed for detecting SARS‐CoV‐
Weinan Liu   +5 more
wiley   +1 more source

Innovation Meets Accessibility in Melt Electrowriting 3D Printer Design: Continuous Process Monitoring and Automation via Modular Software and Hardware

open access: yesAdvanced Materials Technologies, EarlyView.
This manuscript describes the design and validation of an innovative melt electrowriting printer. With a turntable collector and modular software architecture, it unifies previous advanced MEW printer capabilities and enhances adaptability for a wide range of research applications.
Timo Baroth   +3 more
wiley   +1 more source

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

Flexible, Integrated‐Porous Microneedle Sensor for Biofluid Sampling and On‐Site Biomarker Detection

open access: yesAdvanced Materials Technologies, EarlyView.
A paper‐integrated porous PGA microneedle array patch capable of both high strength and absorption capacity is proposed. With an image‐processing system, an optimized colorimetric sensor achieves a low limit of detection of 0.09 mm in cholesterol.
Haitao Deng   +3 more
wiley   +1 more source

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