Results 191 to 200 of about 442,961 (254)

Wafer‐Scale Top‐Down Patterning of Metal Halide Perovskites

open access: yesAdvanced Materials Technologies, EarlyView.
Wafer‐scale patterning of metal halide perovskite films is demonstrated on 150 mm substrates using a chemically amplified resist, polymethyl methacrylate (CAR‐PMMA) and a single reactive ion etching step. The streamlined process preserves film luminescence while defining submicrometer features across the full wafer, enabling dense, scalable integration
Federico Fabrizi   +7 more
wiley   +1 more source

Two‐Step Thermal Upcycling of Flexible Printed Circuit Board Waste Into Metallic Copper Nanoparticles: Synthesis and Characterization

open access: yesAdvanced Materials Technologies, EarlyView.
A two‐step thermal upcycling process converts flexible printed circuit board waste into high‐purity copper nanoparticles using polymer degradation and arc discharge. The synthesized nanoparticles exhibit controlled morphology and high metal purity.
Bikesh S. Ghinangju   +2 more
wiley   +1 more source

Recent Advances in Light‐Addressable Electrochemistry for Spatially Resolved Applications

open access: yesAdvanced Materials Technologies, EarlyView.
This comprehensive review highlights light‐addressable electrochemistry as a powerful tool that uses light to control localized chemical reactions on unstructured semiconductor surfaces. The work evaluates advanced strategies to optimize electrode materials for enhanced spatial resolution and stability. Furthermore, it showcases diverse applications in
Nhi Trang Vo   +2 more
wiley   +1 more source

Conductive Tin Oxide Under the Thermal Budget of Perovskite/TOPCon Tandems: Toward Indium‐Free Contacts

open access: yesAdvanced Materials Technologies, EarlyView.
This work demonstrates that achieving conductive undoped SnOx contacts required careful tailoring of oxygen vacancy (VO) tuning and defect engineering. Controlling oxygen deposition pressure and low‐temperature annealing (300°C) optimizes defect stoichiometry and mitigates carrier scattering. This low thermal budget approach significantly enhances Hall
Paul Llontop   +13 more
wiley   +1 more source

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