Results 251 to 260 of about 510,222 (299)

Material removal rate in polishing anisotropic monocrystalline materials for optoelectronics

Journal of Superhard Materials, 2016
Based on investigations of the mechanism of precision surface formation in workpieces of anisotropic monocrystalline materials for optoelectronics, a generalized model of material removal in polishing with suspensions of polishing powders has been constructed.
O. Yu. Filatov, V. I. Sidorko, S. V. Kovalev, Yu. D. Filatov, A. G. Vetrov   +4 more
openaire   +1 more source

OPTIMAL MACHINING PROJECT CONTROL WITH MATERIAL REMOVAL RATE

Transactions of the Canadian Society for Mechanical Engineering, 2002
A MPC, Machining Project Control, Model to achieve the optimal control of material removal rate (MRR) for a machining project undergoing the considerations of project quantity and production period is established in this study. This paper not only applies material removal rate into the objective function mathematically, but also implements Calculus of
Chun-Hsiung Lan, Tian-Syung Lan, Long-Jyi Yeh   +2 more
openaire   +1 more source

Material removal mechanism beyond plastic wave propagation rate

Precision Engineering, 2003
Abstract Discussed in this report are the material removal mechanisms below and beyond its static plastic wave propagation rate. The ductile materials are expected to behave elastically throughout most of its strength range, and apparently become “brittle” as cutting speed exceeds its static propagation rate.
Libo Zhou, Jun Shimizu, Akihito Muroya, Hiroshi Eda   +3 more
openaire   +1 more source

Effect of EDM parameters on material removal rate, tool wear rate and geometrical errors of aluminium material

Materials Today: Proceedings, 2021
Abstract This investigation reveals the paradigm of EDM in this experiment to expel the metal from Al7075 with a performed Copper electrode. Aluminium7075 has the most elevated quality, higher firmness, and diminished thickness. Aluminium7075 is utilized prevalently in exceedingly focused on applications, for example, brackets, milk churns, mineral ...
L. Selvarajan, R. Sasikumar, N. Senthil Kumar, Prabu Kolochi, P. Naveen Kumar   +4 more
openaire   +1 more source

Increase of material removal rate in peripheral milling by varying feed rate

Journal of Materials Processing Technology, 2008
A new cutting method is proposed for the milling of metals by means of a double stage feed drive mechanism. This design combines the long stroke motion provided by a ball screw feed drive and a fine motion provided by a piezo actuator. The piezo actuator exerts a fluctuating displacement on a flexure platform where the workpiece is clamped.
H. Pérez, J. Rios, E. Díez, A. Vizán
openaire   +1 more source

Assist control for finishing process considering material removal rate

2011 15th International Conference on Advanced Robotics (ICAR), 2011
In high-variety low-volume manufacturing, parts are typically processed by handwork in order to minimize production cost and lead time. However, when a precise finishing process is required, handwork has problems of processing error and insufficient processing accuracy.
Ken'ichi Yano, Nobuaki Sakai, Norihiko Kato   +2 more
openaire   +1 more source

Material Removal Rate Prediction using the Classification-Regression Approach

2020 IEEE 22nd Electronics Packaging Technology Conference (EPTC), 2020
Chemical Mechanical Polishing (CMP) is one of the most critical process step in the fabrication of advanced packages, such as Fanout Wafer Level Packaging (FOWLP). CMP process requires tight and dynamic control of process parameters to achieve palnarization, high quality and reliability of organic or in-organic redistribution layer (RDL) surface ...
Kart-Leong Lim, Rahul Dutta
openaire   +1 more source

Modeling of Material Removal Rate in Micro-ECG Process

Journal of Manufacturing Science and Engineering, 2008
Microelectrochemical grinding (micro-ECG) is a variant of electrochemical grinding (ECG) process, in which material is removed by a combination of electrolytic dissolution and abrasive action that take place in a small interelectrode gap. This paper discusses analytical modeling of the material removal phenomenon in micro-ECG process to predict ...
GAIKWAD, KS, JOSHI, SS
openaire   +2 more sources

The Material Removal Rate of Metal Polishing Process

2009
The objective of this research is to better understand the mechanisms of material removal in the polishing process. This study is aimed to establish a material removal rate model for metal polishing to predict the result of metal polishing process.
Yeau-Ren Jeng, Pay-Yau Huang
openaire   +1 more source

Deformation and material removal rate in polishing silicon wafers

Journal of Materials Processing Technology, 2003
Abstract The aim of the present work was to explore the deformation mechanism and to estimate the material removal rate (MRR) in polishing silicon wafers. The surface roughness was studied by atomic force microscope and subsurface damage was assessed by means of cross-section transmission electron microscopy.
I. Zarudi, B.S. Han
openaire   +1 more source