Results 181 to 190 of about 156,572 (295)

Micropillar‐Engineered Hybrid Adhesive Patch for Surface‐Conformable and Directional Adhesion

Advanced Materials Technologies, EarlyView.
This work presents a surface‐conformable hybrid adhesive integrating height‐optimized hexagonal micropillars with open‐rectangular cuts. The micropillars enhance rough‐surface contact and microscale crack arrest, while the cuts guide and reverse interfacial cracks for strong and directional adhesion. The multiscale architecture achieves robust pull‐off
Seongjin Park, Dong Kwan Kang, Haejin Bae, Ho‐Sup Jung, Hoon Eui Jeong   +4 more
wiley   +1 more source

Experimental and numerical investigation of the axial compressive behavior of GFRP-reinforced concrete walls under concentric and eccentric loading. [PDF]

Sci Rep
El-Sayed TA, Ibrahim MM, Shanour AS, Mohamed Fahmy YGE.   +3 more
europepmc   +1 more source

Overcoming Printing and Interfacial Challenges in Liquid Metal Direct Writing for Integrated Stretchable Electronics

Advanced Materials Technologies, EarlyView.
Liquid metal direct writing is advanced from a technological and fundamental point. Utilizing a kinematic bed, printing on large surfaces with irregularities is enabled. Furthermore, a pressure‐driven flow during printing is discovered that affects the thickness of traces.
Maximilian Krack, Lennert Purnal, Parth Vinayakrao Sewlikar, Sam Cuyvers, Gus Geurts, Rathul Nengminza Sangma, Derese Desta, Dieter Reenaers, Bart Ruttens, Iris De Graeve, Tom Hauffman, Seppe Terryn, Bram Vanderborght, Michaël Daenen, Wim Deferme, Monika Rai   +15 more
wiley   +1 more source

Dynamic coupling effects of geometric eccentricity on multi-stage gear transmission via stiffness modulation and error excitation. [PDF]

Sci Rep
Lu W, Liang G, Du Z, Huang W, Zhao X.
europepmc   +1 more source

Large‐Scale and Cost‐Effective Fabrication of Ultra‐Thin, Biodegradable Microelectrode Arrays and Pressure Sensors Using Laser Micromachining

Advanced Materials Technologies, EarlyView.
A mask‐free and cost‐effective UV‐pico‐second laser‐based microfabrication method is proposed to fabricate large‐area biodegradable microelectrode arrays and pressure sensors. These devices demonstrate low impedance, good conformability, excellent biocompatibility, and rapid degradation, providing a new route for next‐generation transient electronics ...
Bhavani Prasad Yalagala, Asfand Tanwear, María Cerezo‐Sánchez, Hossein Parvizi, Morteza Amjadi, Hadi Heidari   +5 more
wiley   +1 more source

Numerical Analysis of Bifacial Photovoltaic Panels Subjected to Repeated Loading. [PDF]

Materials (Basel)
Jankowiak T, Białasik J, Łasecka-Plura M, Kuczma M.   +3 more
europepmc   +1 more source

Transducers Across Scales and Frequencies: A System‐Level Framework for Multiphysics Integration and Co‐Design

Advanced Materials Technologies, EarlyView.
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu, Mengyao Xiao, Zhouli Sui, Yinpeng Wang, Daoye Zheng, Yuxin Liu, Luwei Wang, Huajun Liu, Chengkuo Lee   +8 more
wiley   +1 more source

Kinetostatic Modeling and Performance Analysis of a Symmetric Redundant-Actuated 4-PSS Compliant Parallel Micro-Motion Mechanism. [PDF]

Micromachines (Basel)
Ren J, Lu Y.
europepmc   +1 more source

Chemically Doped Conductive Polymers for Wearable Health Monitoring

Advanced Materials Technologies, EarlyView.
Among conductive polymers, poly(3,4‐ethylenedioxythiophene):poly(styrenesulfonate) (PEDOT:PSS), polyaniline (PANI), and polypyrrole (PPy) are the most studied and applied. Chemical doping significantly boosts intrinsic conductivity and mechanical robustness.
Mengdi Zuo, Jian Song, Hong Hu, Le Zheng, Lei Zhang, Charles H. Lawrie   +5 more
wiley   +1 more source

Investigation of finite element simulation-based bond-slip effect for seismically vulnerable school reinforced concrete building frame. [PDF]

Sci Rep
Kang H, Lee K, Shin S, Woo J, Shin J.
europepmc   +1 more source