Results 101 to 110 of about 18,759 (250)

Electrochemically Induced Interphase by Complex Hydride Anions in Argyrodite Solid Electrolytes for Stable Lithium Metal All‐Solid‐State Batteries

open access: yesAdvanced Science, EarlyView.
Complex hydride anion substitution in argyrodite electrolytes has attracted attention for improving interfacial stability, yet the influence of these anions at Li metal interfaces remains unclear. This work shows that electrochemically formed BH4−‐derived interphases enable stable high‐current full‐cell cycling.
Sangho Lee   +13 more
wiley   +1 more source

Large‐Scale Growth of Self‐Poled Ferroelectric Rashba Semiconductor α‐GeTe(111) Thin Films: A Crucial Step Towards Future CMOS‐Compatible Ferroelectric Spintronic Devices

open access: yesAdvanced Science, EarlyView.
Ferroelectric Rashba semiconductors promise ultralow‐power devices but lack industry‐quality films. This work demonstrates CMOS‐compatible fabrication of high‐quality α‐GeTe(111) films via magnetron sputtering, enabled by a 5 nm Sb2Te3 seed layer. Structural and ferroelectric analyses show robust, switchable polarization comparable to MBE films, paving
Jules Lagrave   +14 more
wiley   +1 more source

On understanding milling characteristics of TC4 alloy during graphene nanofluid minimum quantity lubrication with bionic micro-texture tool

open access: yesJournal of Materials Research and Technology
TC4 alloy has excellent comprehensive properties and is widely applied in the aircraft, medical device, and chemical equipment. However, the cutting area cooling and lubrication state is very poor by reason of the high mechanical strength, poor heat ...
Ming Li   +8 more
doaj   +1 more source

Multifaceted Roles of Tantalum in Promoting the Thermoelectric Performance of Mg3(Sb,Bi)2 Based Materials

open access: yesAdvanced Science, EarlyView.
A multifunctional tantalum incorporation strategy enables simultaneous tuning of carrier concentration, mitigation of grain‐boundary scattering, and enhanced phonon scattering in Mg3(Sb,Bi)2. These synergistic effects markedly improve carrier mobility and suppress lattice thermal conductivity, yielding both high material zT and high module conversion ...
Guangmeng You   +9 more
wiley   +1 more source

Performance evaluation of cold plasma and h-BN nano-lubricant multi-field coupling assisted micro-milling of aluminum alloy 6061-T651

open access: yesAlexandria Engineering Journal
Micro-milling has been employed in various fields due to its efficiency, flexibility, material, and structural versatility in the machining of small and high-quality parts.
Zhenjing Duan   +6 more
doaj   +1 more source

Analysis and simulation of micro milling process

open access: yes, 2013
Micro milling operation is one of the advanced machining processes to manufacture miniature parts in biomedical, optics and electronics industries. The chip thickness in micro milling is comparable to the tool edge radius, which brings strong size effect to the cutting performance and makes prediction of the cutting forces more challenging.
openaire   +2 more sources

Beyond Percolation: Graphene‐Enabled Network Reinforcement Enhances Thermal Transport in Paraffin Phase‐Change Composites

open access: yesAdvanced Science, EarlyView.
Expanded‐graphite/graphene‐nanoplatelet hybrids deliver a near‐order‐of‐magnitude thermal‐conductivity enhancement in paraffin phase‐change materials. A microCT‐informed 3D modeling framework resolves the percolating EG backbone and captures sub‐voxel GNP enrichment, quantitatively linking microstructure to heat flow and revealing a graphene‐enabled ...
Thomas Hoke   +4 more
wiley   +1 more source

Dynamically Modified Flexible Zn Powder Anodes with Stable Performance at High Rate and High Zn Utilization

open access: yesAdvanced Science, EarlyView.
A dynamically shape‐variant liquid metal‐based network is integrated into Zn powder electrode, where intrinsic fluidity and structural adaptability of the liquid metal‐based network enable effective mitigation of dendritic growth, alleviation of stress accumulation, and prevention of Zn loss during Zn plating‐stripping processes.
Yuxuan Wang   +9 more
wiley   +1 more source

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