Results 31 to 40 of about 2,617,186 (294)
A continuous beam scanning leaky-wave antenna (LWA) supporting lateral radiation is proposed in this paper. It is based on a spoof surface plasmon (SSP) transmission line (TL) which is a single-layer conductor structure.
Leilei Liu +4 more
doaj +1 more source
As an important structural system for effectively improving power delivered to the load (PDL) and power transmission range, multiple-transmitter (TX) and single-receiver (RX) wireless power transfer (WPT) system is gaining more and more attention in both
Jin Zhang +3 more
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Three-dimensional (3D) micro-jet printing is a droplet deposition technique based on liquid-phase materials. To improve the deposition density and performance of energetic films with micro/nanoscale on an energetic chip, polydopamine (PDA) was utilized ...
Chun-yan Li +5 more
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Micro and Nano Manipulation and Assembly by Optically Induced Electrokinetics
Manipulation devices based on magnetic forces, acoustic waves, hydrodynamic flows, light waves, or electrokinetic forces are among the major noninvasive technologies available today.
Liu, Lianqing +9 more
core +2 more sources
This paper proposes a novel circularly polarized antenna operating at 2.4-2.48-GHz industrial, scientific, and medical (ISM) band for biomedical applications.
Li-Jie Xu +4 more
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Equivalent model and limit for the SOI lateral power device using high-k dielectric
This paper presents a simple and clear equivalent model to investigate the SOI lateral power device using high-k dielectric (HK device). The proposed model can accurately characterize the electric field and facilitate the obtainment of optimal breakdown ...
Jiafei Yao +5 more
doaj +1 more source
Precision Micro Assembly of Optical Components on MID and PCB
International audienceAt HSG-IMAT the precision assembly of micro systems became increasingly important in recent years. The challenge is to reach a high accuracy of about 10 μm between the assembled elements.
Seybold, Jonathan +7 more
core +1 more source
Focused Ion Beam Micro Machining and Micro Assembly [PDF]
The ability to manufacture and manipulate components at the micro-scale is critical to the development of micro systems. This paper presents the technique to manipulate micro/nano parts at the micro/nano-scale using an integrated Focused Ion Beam (FIB) system composed of scanning electron microscope, micro manipulator and gas injection system ...
Hongyi Yang, Svetan M. Ratchev
openaire +2 more sources
Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics
This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electronic ...
Joachim N. Burghartz +9 more
doaj +1 more source
Ultrasonic bonding has an increasing application in the micro assembly of polymeric micro-electro mechanical systems (MEMS) with high requirements for fusion precision. In the ultrasonic bonding process, the propagation of ultrasonic vibration in polymer
Yibo Sun, Feng Wang, Xinhua Yang
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