Results 31 to 40 of about 2,617,186 (294)

Single-Beam Leaky-Wave Antenna With Lateral Continuous Scanning Functionality Based on Spoof Surface Plasmon Transmission Line

open access: yesIEEE Access, 2019
A continuous beam scanning leaky-wave antenna (LWA) supporting lateral radiation is proposed in this paper. It is based on a spoof surface plasmon (SSP) transmission line (TL) which is a single-layer conductor structure.
Leilei Liu   +4 more
doaj   +1 more source

A Comparative Study on Current- and Voltage-Optimized Circuit Scheme for Multiple-Transmitter and Single-Receiver WPT System

open access: yesJournal of Electrical and Computer Engineering, 2020
As an important structural system for effectively improving power delivered to the load (PDL) and power transmission range, multiple-transmitter (TX) and single-receiver (RX) wireless power transfer (WPT) system is gaining more and more attention in both
Jin Zhang   +3 more
doaj   +1 more source

Fabrication and characterization of mussel-inspired layer-by-layer assembled CL-20-based energetic films via micro-jet printing

open access: yesDefence Technology, 2022
Three-dimensional (3D) micro-jet printing is a droplet deposition technique based on liquid-phase materials. To improve the deposition density and performance of energetic films with micro/nanoscale on an energetic chip, polydopamine (PDA) was utilized ...
Chun-yan Li   +5 more
doaj   +1 more source

Micro and Nano Manipulation and Assembly by Optically Induced Electrokinetics

open access: yes, 2015
Manipulation devices based on magnetic forces, acoustic waves, hydrodynamic flows, light waves, or electrokinetic forces are among the major noninvasive technologies available today.
Liu, Lianqing   +9 more
core   +2 more sources

Circularly Polarized Annular Ring Antenna With Wide Axial-Ratio Bandwidth for Biomedical Applications

open access: yesIEEE Access, 2019
This paper proposes a novel circularly polarized antenna operating at 2.4-2.48-GHz industrial, scientific, and medical (ISM) band for biomedical applications.
Li-Jie Xu   +4 more
doaj   +1 more source

Equivalent model and limit for the SOI lateral power device using high-k dielectric

open access: yesResults in Physics, 2019
This paper presents a simple and clear equivalent model to investigate the SOI lateral power device using high-k dielectric (HK device). The proposed model can accurately characterize the electric field and facilitate the obtainment of optimal breakdown ...
Jiafei Yao   +5 more
doaj   +1 more source

Precision Micro Assembly of Optical Components on MID and PCB

open access: yes, 2014
International audienceAt HSG-IMAT the precision assembly of micro systems became increasingly important in recent years. The challenge is to reach a high accuracy of about 10 μm between the assembled elements.
Seybold, Jonathan   +7 more
core   +1 more source

Focused Ion Beam Micro Machining and Micro Assembly [PDF]

open access: yes, 2010
The ability to manufacture and manipulate components at the micro-scale is critical to the development of micro systems. This paper presents the technique to manipulate micro/nano parts at the micro/nano-scale using an integrated Focused Ion Beam (FIB) system composed of scanning electron microscope, micro manipulator and gas injection system ...
Hongyi Yang, Svetan M. Ratchev
openaire   +2 more sources

Hybrid Systems-in-Foil—Combining the Merits of Thin Chips and of Large-Area Electronics

open access: yesIEEE Journal of the Electron Devices Society, 2019
This paper reports on the status of a comprehensive ten-year research and development effort toward hybrid system-in-foil (HySiF). In HySiF, the merits of high-performance integrated circuits on ultra-thin chips and of large-area and discrete electronic ...
Joachim N. Burghartz   +9 more
doaj   +1 more source

Theoretical and Experimental Study on Vibration Propagation in PMMA Components in Ultrasonic Bonding Process

open access: yesMicromachines, 2017
Ultrasonic bonding has an increasing application in the micro assembly of polymeric micro-electro mechanical systems (MEMS) with high requirements for fusion precision. In the ultrasonic bonding process, the propagation of ultrasonic vibration in polymer
Yibo Sun, Feng Wang, Xinhua Yang
doaj   +1 more source

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