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Microchannel integrated heat sinks in silicon technology

Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242), 2002
The use of microchannels in silicon substrates as a forced liquid cooling device for power integrated circuits is investigated. Thermal dissipation characteristics are calculated for several microchannels geometry. An optimised structure is proposed and its technological realisation is described.
C. Perret, C. Schaeffer, J. Boussey
openaire   +1 more source

Flow Boiling in a Microchannel Heat Sink

Heat Transfer, Part A, 2005
Flow boiling heat transfer in a microchannel heat sink is experimentally investigated. The microchannels considered are 275 μm wide and 636 μm deep, and the experiments are conducted at inlet water temperatures in the range of 66 to 95°C and mass fluxes of 341 to 936 kg/m2s.
Dong Liu, Suresh V. Garimella
openaire   +1 more source

Heat sink optimization with application to microchannels

IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1992
The equations governing the fluid dynamics and combined conduction/convection heat transfer in a heat sink are presented in dimensionless form for both laminar and turbulent flow. A scheme presented for solving these equations permits the determination of heat sink dimensions that display the lowest thermal resistance between the hottest portion of the
R.W. Knight   +3 more
openaire   +1 more source

Optimization design of microchannel cooling heat sink

International Journal of Numerical Methods for Heat & Fluid Flow, 2007
PurposeThis paper sets out to optimize the shape and size of microchannels cooling heat sink, which has been widely used to cool electronic chip for its high heat transfer coefficient and compact structure.Design/methodology/approachSequential Quadratic Programming (SQP) method is used to optimize the cross‐section sizes of microchannels. Finite volume
Baodong Shao, Zhaowei Sun, Lifeng Wang
openaire   +1 more source

Heat Transfer of a Double Layer Microchannel Heat Sink

Applied Mechanics and Materials, 2013
A numerical study is conducted to predict the effects of physical parameters of a double layer microchannel heat sink on heat transfer. The physical parameters investigated are the channel height and channel width for different flow orientation at the upper and lower channels.
Wong Kok Cheong   +1 more
openaire   +1 more source

Heat transfer of Al2O3 nanofluids in microchannel heat sink

AIP Conference Proceedings, 2017
Microchannel heat sink creates an innovative cooling technology to remove large amount of heat from small area. Recently, nanotechnology gain interest to explore the microchannel cooling benefits of nanofluids as working fluid. The objective of this study is to investigate the effect of heat transfer to Al2O3 nanofluids after used as working fluid in ...
A. A. Razali, A. Sadikin, S. A. Ibrahim
openaire   +1 more source

Heat transfer in rectangular microchannels heat sink using nanofluids

International Communications in Heat and Mass Transfer, 2010
Abstract The effect of using nanofluids on heat transfer and fluid flow characteristics in rectangular shaped microchannel heat sink (MCHS) is numerically investigated for Reynolds number range of 100–1000. In this study, the MCHS performance using alumina–water (Al2O3-H2O) nanofluid with volume fraction ranged from 1% to 5% was used as a coolant is ...
H.A. Mohammed   +2 more
openaire   +1 more source

Heat transfer analysis of nanofluid based microchannel heat sink

International Journal of Heat and Mass Transfer, 2018
Abstract Heat generation in miniature electronic devices is a limiting factor that often adversely affects device performance. One prominent remedy for this problem is to adopt nanofluid based microchannel heat sinks embedded with pin fins. The performance of these heat sinks depends on their geometry and coolant properties.
Mohammad Zargartalebi, Jalel Azaiez
openaire   +1 more source

Heat Transfer in Microchannel Heat Sink Using Nanofluids

Delta University Scientific Journal, 2022
Nagwa Hamshary, Ahmed Shmouty
openaire   +1 more source

Transforming heat transfer with thermal metamaterials and devices

Nature Reviews Materials, 2021
Ying Li, Wei Li, Tiancheng Han
exaly  

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