Results 1 to 10 of about 381 (138)

On conjugate heat transfer in microchannel heat sinks

open access: yesInternational Journal of Thermofluids
This work aims to study the anisotropic thermal impacts of employing liquid metal fluids including Na and NaK as coolants in two metallic microchannel heat sinks. The two studied microchannel heat sinks have aspect ratios of 1 and 2 while their hydraulic
Nima Fathi   +4 more
doaj   +2 more sources

Numerical Analysis of Microchannels Designed for Heat Sinks [PDF]

open access: yesNanomanufacturing and Metrology, 2021
AbstractConjugate heat transfer is numerically investigated using a three-dimensional computational fluid dynamics approach in various microchannel geometries to identify a high-performance cooling method for piezoelectric ceramic stacks and spindle units in high-precision machines.
Matthew McCormack   +2 more
openaire   +2 more sources

Characteristics of MEMS Heat Sink Using Serpentine Microchannel for Thermal Management of Concentrated Photovoltaic Cells

open access: yesIEEE Access, 2023
This work explains the simulation-based study to understand the thermohydraulic characteristics (thermal resistance and pumping power) of a MEMS heat sink using serpentine microchannels employed for thermal management of concentrated photovoltaic cells ...
Dinumol Varghese   +2 more
doaj   +1 more source

Performance Improvement of a Double-Layer Microchannel Heat Sink via Novel Fin Geometry—A Numerical Study

open access: yesEnergies, 2021
This study proposes a novel design having dense fins with lesser thickness at the upper layer and comparatively spare fins with greater thickness in the lower layer to further improve the overall thermal performance of a double-layer microchannel heat ...
Yong-Dong Zhang   +4 more
doaj   +1 more source

Experimental Study on Heat Transfer Performance of Microchannel Applied with Manifold [PDF]

open access: yes한국정밀공학회지, 2022
In this paper, theoretical and experimental studies were conducted on the cooling performance of a microchannel heat dissipation device with a manifold layer added.
Jungmyung Kim, Hoyong Jang, Heesung Park
doaj   +1 more source

Design and Analysis of Microchannels for Heat Dissipation of High-Energy VCSELs Based on Laser 3D Printing

open access: yesApplied Sciences, 2022
For the problem of high waste heat in the active area of high-power VCSEL arrays and the difficulty of heat dissipation, we took advantage of laser 3D printing technology and combined it with the relevant principles of fluid-structure coupling, three ...
Anru Yan   +3 more
doaj   +1 more source

Thermal–Hydrodynamic Behavior and Design of a Microchannel Pin-Fin Hybrid Heat Sink

open access: yesMicromachines, 2022
A three-dimensional convective heat transfer model of a microchannel pin-fin hybrid heat sink was established. Considering the non-uniform heat generation of 3D stacked chips, the splitting distance of pin-fins was optimized by minimizing the maximum ...
Xiaonan Guan   +5 more
doaj   +1 more source

Hydrothermal Investigation of a Microchannel Heat Sink Using Secondary Flows in Trapezoidal and Parallel Orientations

open access: yesEnergies, 2020
Thermal performance enhancement in microchannel heat sinks has recently become a challenge due to advancements in modern microelectronics, which demand compatibility with heat sinks able to dissipate ever-increasing amounts of heat.
Safi Ahmed Memon   +3 more
doaj   +1 more source

Performance analysis of microchannel heat sink with flow disrupting pins

open access: yesJournal of Thermal Engineering, 2022
Study of thermo-hydraulic characteristics of a novel microchannel heat sink having flow disrupting pins is numerically and experimentally carried out in this paper. Cylindrical pins are inserted from top cover into the rectangular microchannel instead of
V. P. GAIKWAD, S. S. MOHITE
doaj   +1 more source

Numerical Study of Fluid Flow and Heat Transfer Characteristics in a Cone-Column Combined Heat Sink

open access: yesEnergies, 2021
Temperature has a great influence on the normal operation and service life of high-power electronic components. To cope with the increasingly severe heat problems in integrated circuits, an enhanced heat transfer factor E is introduced to evaluate the ...
Wei Zheng   +5 more
doaj   +1 more source

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