Results 21 to 30 of about 1,588,788 (208)

Analysis of heat transfer and fluid flow in a microchannel heat sink with sidewall dimples and fillet profile [PDF]

, 2022
The performance of microchannel with sidewall dimples and fillet profile in the bottom surface is investigated. Two dimple sizes of (0.5 mm and 1 mm) are systematically clustered along the channels with and without fillet are considered. The laminar flow
Hayder M. Hasan, Mushtaq Hamzah, Hamzah, Mushtaq, Egab, Karim, Al-Manea, Ahmed, Ahmed Al-Manea, Okab, Abdullah K., Abdullah K. Okab, Karim Egab, Hasan, Hayder M., Yusaf, Talal, Talal Yusaf   +11 more
core   +1 more source

Experimental Investigation of Sub-Cooled Flow Boiling in Metallic Microchannel [PDF]

Engineering and Technology Journal, 2019
Experiments in microchannel heat sink were carried that examine the deionized water two-phase boiling heat transfer. The heat sink consisted of a single microchannel having 300μm wide nominal dimensions and 300μm height (hydraulic diameter of 300μm). The
Suha mohammed, Ekhlas Fayyadh
doaj   +1 more source

Experimental Investigation on the Heat Transfer Characteristics of Multi-Point Heating Microchannels for Simulating Solar Cell Cooling

Energies, 2022
Concentrating photovoltaic power generation technology is a highly efficient way of utilizing solar energy resources with the efficiency limited by cell cooling conditions.
Qi Yang, Yanpei Huang, Zitian Niu, Yuandong Guo, Qi Wu, Jianyin Miao   +5 more
doaj   +1 more source

Improving Geometry of Microchannel Heat Sinks by Adding Fins to Walls of Microchannels [PDF]

Iranica Journal of Energy and Environment
The dissipation of heat generated in electronic and industrial chips is essential for the safe operation of these components. For this purpose, one of the best choices is a microchannel heat sink, which offers a lower pressure drop compared to other ...
F. Nasiri Khamesloo, D. Domiri Ganji
doaj   +1 more source

Pressure Drop of Microchannel Plate Fin Heat Sinks [PDF]

Micromachines, 2019
The entrance region constitutes a considerable fraction of the channel length in miniaturized devices. Laminar slip flow in microchannel plate fin heat sinks under hydrodynamically developing conditions is investigated semi-analytically and numerically in this paper.
Zhipeng Duan, Hao Ma, Boshu He, Liangbin Su, Xin Zhang   +4 more
openaire   +3 more sources

Numerical analysis and parametric study of multilayered microchannel heat sinks

Advances in Mechanical Engineering, 2015
A three-dimensional solid–fluid conjugated model is used to investigate and optimize the performances of two-, three-, and four-layered microchannel heat sinks. In the optimization process, constraints of fixed total pumping power and fixed total channel
Lin Lin, Min-Xin Deng, Xin-Xin Zhang, Xiao-Dong Wang   +3 more
doaj   +1 more source

An experimental investigation of flow boiling heat transfer of R-141b and R-1234yf in microchannels

MATEC Web of Conferences, 2017
This study presents experimental results of flow boiling heat transfer of refrigerants R-141b and R-1234yf in a horizontal microchannel heat sink. The copper microchannel heat sink contains 21 microchannels with 335×930 μm cross-section.
Shamirzaev Alisher
doaj   +1 more source

Effect of liquid cooling on PCR performance with the parametric study of cross-section shapes of microchannels

Scientific Reports, 2021
In recent years, PCR-based methods as a rapid and high accurate technique in the industry and medical fields have been expanded rapidly. Where we are faced with the COVID-19 pandemic, the necessity of a rapid diagnosis has felt more than ever.
Yousef Alihosseini, Mohammad Reza Azaddel, Sahel Moslemi, Mehdi Mohammadi, Ali Pormohammad, Mohammad Zabetian Targhi, Mohammad Mahdi Heyhat   +6 more
doaj   +1 more source

Computational analysis of heat transfer and fluid flow characteristics in a diamond microchannel heat sink with orthogonal ribs

Case Studies in Thermal Engineering
As electronic devices advance toward higher power densities and increased miniaturization, the resulting rise in heat flux presents significant challenges to their performance, reliability, operational lifespan, and energy efficiency.
Liang Du, Wenbo Hu, Ningkang Deng, Zhaoyang Zhang, Hongxing Wang   +4 more
doaj   +1 more source

Optimization of stepwise varying width microchannel heat sink for high heat flux applications

Case Studies in Thermal Engineering, 2020
The semiconductor devices are widely employed for many applications. A significant amount of the heat must be dissipated properly to keep the devices' performance stable.
Essam M. Abo-Zahhad, Shinichi Ookawara, Ali Radwan, M.F. Elkady, A.H. El-Shazly   +4 more
doaj   +1 more source