Results 161 to 170 of about 1,322 (222)

Cilia induced transport of microorganisms in Bingham plastic fluid with wall slip in asymmetric microchannel. [PDF]

Sci Rep
Ibrahim N, Javed M, Imran N, Eressa LA.
europepmc   +1 more source

Fluid-structure interaction and thermal performance: a numerical study on crossflow heat exchangers with aerodynamically optimised splitter elements. [PDF]

Sci Rep
Kaushik S, Singh H, Kumar A, Kishore C, Pati PR, Chamoli S, Giri J, Kanan M.   +7 more
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Optimization of hydrothermal performance in industrial heat sinks with innovative perforated pin fin designs: A numerical approach. [PDF]

Heliyon
Zohora FT, Haque MR, Chowdhury NM, Fahad MK, Ifraj NF.   +4 more
europepmc   +1 more source

Simulation of <i>Fe</i>₃<i>O</i>₄ Nanoparticle Transport in a Diseased Curved Artery Under Thermal Influence: Implications for Targeted Drug Delivery. [PDF]

Nanomaterials (Basel)
Poonam, Sharma BK, Gandhi R, Laroze D.
europepmc   +1 more source

Machine learning investigation of marangoni convection in hybrid nanofluids with Darcy-Forchheimer. [PDF]

Sci Rep
Qureshi H, Altmeyer S, Zubair M.
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Mathematical modeling for nonlinear slippery-hybrid nanofluid flow with radiation impacts and thermophoretic diffusion via a porous medium. [PDF]

Discov Nano
Al-Atawi NO.
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Forced convection heat transfer in microchannel heat sinks

International Journal of Heat and Mass Transfer, 2007
Abstract This paper presents an analysis of forced convection heat transfer in microchannel heat sinks for electronic system cooling. In view of the small dimensions of the microstructures, the microchannel is modeled as a fluid-saturated porous medium. Numerical solutions are obtained based on the Forchheimer–Brinkman-extended Darcy equation for the
Chien-Hsin Chen
exaly   +2 more sources

Comparison Between Traditional Microchannels Heat Sinks and Microchannels Heat Sinks Based on Biomimical Tendencies

Volume 4: Fatigue and Fracture; Fluids Engineering; Heat Transfer; Mechatronics; Micro and Nano Technology; Optical Engineering; Robotics; Systems Engineering; Industrial Applications, 2008
In the last few years high-tendency electronic devices have improved to a larger processing capability with smaller physical dimensions. This fact coupled to traditional cooling mechanisms, are not able to dissipate the high heat fluxes generated by these devices (around 200 W/cm2.) Microchannel heat sinks are the new tendency in heat dissipation. Many
Carlos A. Rubio-Jimenez, Abel Hernandez-Guerrero, Cuauhtemoc Rubio-Arana, Daniela Popescu   +3 more
openaire   +1 more source