Results 41 to 50 of about 1,322 (222)
Are the available boiling heat transfer coefficients suitable for silicon microchannel heat sinks?
The typical MEMS fabrication of micro evaporators ensures the perfect smooth wall surface that is lack of nucleation sites, significantly decreasing the heat transfer coefficients compared with miniature evaporators fabricated using copper or stainless ...
Wang, Shuangfeng +2 more
core +1 more source
This study demonstrates the feasibility of an underground closed‐loop thermal storage facility at a post‐mining site, intended for seasonal heat energy storage. Its principal design shows water flow directions in winter and summer (1, 2), heat pumps (3), an upper water reservoir (4), and connecting pipes (5).
Dmytro Rudakov, Oleksandr Inkin
wiley +1 more source
Analysis and optimization of the thermal performance of microchannel heat sinks
PurposeTo provide modeling approaches of increasing levels of complexity for the analysis of convective heat transfer in microchannels which offer adequate descriptions of the thermal performance, while allowing easier manipulation of microchannel geometries for the purpose of design optimization of microchannel heat sinks.Design/methodology/approachA ...
Liu, Dong, Garimella, S V
openaire +4 more sources
This article details the mathematical modeling and experimental validation of a liquid based MEMS heat sink using wavy microchannels with pin-fins for cooling of microelectronic chips with heat flux of 1000 kW/m2. The characteristics of the heat sink are
Anas Alkhazaleh +3 more
doaj +1 more source
Fish Scales: A Multifunctional Biomaterial from Nature
Fish scales demonstrate nature's solution to impact protection through overlapping multilayered architecture. This biological design combines mineralized surfaces with collagen networks to achieve both flexibility and fracture resistance. The structural principles inspire advanced protective materials and biomedical implants, where damage tolerance ...
Liyao Dong, Xiaojie Sun, Xiguang Chen
wiley +1 more source
Porous-fin microchannel heat sinks for future micro-electronics cooling
Porous-fin microchannel heat sinks offering high solid-fluid interfacial areas have the potential to be an integral part of future microelectronic cooling systems.
Bigham, Sajjad +3 more
core +1 more source
Microchannel Heat Sink Based on Boiling Heat Transfer.
Development of a heat sink for future integrated circuit chips has been achieved on the basis of boiling heat transfer in a vertical microchannel. The microchannel was manufactured on a 1.5 mm-thick copper plate by electric discharge machining. The performance of the three kinds of micro-channel heat sinks of which cross sections were 2, 4, and 16 mm ...
Takahashi, Ichiro, Ishikawa, Eisuke
openaire +2 more sources
As electronic devices advance toward higher power densities and increased miniaturization, the resulting rise in heat flux presents significant challenges to their performance, reliability, operational lifespan, and energy efficiency.
Liang Du +4 more
doaj +1 more source
ABSTRACT Compact plate‐fin heat exchangers (PFHEs) are commonly utilized in diverse industries, including aerospace, automotive, processing, and space. Various fin configurations, such as Plain fins, Wavy fins, Lance and Offset fins (OSFs), Perforated fins, louvered fins, and pin fins, are employed in compact heat exchangers (CHEs).
Chennu Ranganayakulu
wiley +1 more source
Single-phase liquid-cooling microchannels have received great attention to remove the gradually increased heat loads of heat sinks. Proper changes of the flow path and/or heat transfer surface can result in much better thermal performance of microchannel
Xie, Gongnan +5 more
core +1 more source

