Results 41 to 50 of about 109,693 (288)

Die attach failures related to wafer back metal processing - An AES study

, 1997
Microelectronics Reliability373519 ...
Radhakrishnan, M.K., M.K. Radhakrishnan
core   +1 more source

Biodegradable and Biocompatible Functional Polymers for Biomedical Applications

Advanced Functional Materials, EarlyView.
Biodegradable and biocompatible functional polymers integrate electrical, mechanical, and stimuli‐responsive functionalities while enabling programmed degradation under physiological conditions. This review introduces recent advances in conductive, shape‐memory, self‐healing, photocurable, and adhesive polymer systems, emphasizing material design ...
Won Bae Han, Shuvra Mondal, Sungkeun Han, Chan‐Hwi Eom, Venkata Ramesh Naganaboina, Suk‐Won Hwang   +5 more
wiley   +1 more source

Microelectronics Journal

, 2009
Published since 1969, Microelectronics Journal is an international forum for the dissemination of research into, and applications of, microelectronics.
METRA, CECILIA
core   +1 more source

A high-quality cross-sectional transmission electron microscope specimen preparation technique for structural and interfacial property studies in microelectronic packaging

, 1995
Microelectronics Reliability355807 ...
Jiaji, W., Wang Jiaji, Qin Wei, Yi, C., M.R. Marks, Chen Yi, Marks, M.R., Wei, Q.   +7 more
core   +1 more source

Emerging Post‐CMOS Hardware Neurons for Brain‐Inspired Computing: Devices, Circuits, and System Integration

Advanced Functional Materials, EarlyView.
The physical realization of artificial neurons is a critical challenge for energy‐efficient neuromorphic computing. This review presents a comprehensive analysis of the evolution of artificial neuron implementations from conventional CMOS to emerging post‐CMOS technologies.
Kannan Udaya Mohanan, Hocheon Yoo, Benoît H. Lessard, Ioannis Kymissis, Chang‐Hyun Kim   +4 more
wiley   +1 more source

Nanotechnology and Nanoscience – From Past Breakthroughs to Future Prospects [PDF]

Informacije MIDEM, 2021
J. Štremfelj, F. Smole
doaj   +1 more source

Corner Simulation of CMOS Analog Integrated Circuit Taking into Account Radiation Influence

Micromachines
This paper proposes a corner analysis approach for CMOS circuits taking into the account radiation effects. The presented simulation approach is implemented using the open-source design automation (EDA) software QUCS-S 25.2.0 and Ngspice 45.
Sergei Ryzhov, Vadim Kuznetsov, Vladimir Andreev   +2 more
doaj   +1 more source

3D Printed MEMS Technology—Recent Developments and Applications

Micromachines, 2020
Microelectromechanical systems (MEMS) are of high interest for recent electronic applications. Their applications range from medicine to measurement technology, from microfluidics to the Internet of Things (IoT).
Tomasz Blachowicz, Andrea Ehrmann
doaj   +1 more source

Optimizing PMMA solutions to suppress contamination in the transfer of CVD graphene for batch production

Beilstein Journal of Nanotechnology, 2022
Mass production and commercial adoption of graphene-based devices are held back by a few crucial technical challenges related to quality control. In the case of graphene produced by chemical vapor deposition, the transfer process represents a delicate ...
Chun-Da Liao, Andrea Capasso, Tiago Queirós, Telma Domingues, Fatima Cerqueira, Nicoleta Nicoara, Jérôme Borme, Paulo Freitas, Pedro Alpuim   +8 more
doaj   +1 more source

Predictive Densities for the Lognormal Distribution and Their Applications

, 1999
Microelectronics Reliability4061051 ...
Yang, Z., YANG, Zhenlin
core   +1 more source