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Novel 4H-SiC Double-Trench MOSFETs with Integrated Schottky Barrier and MOS-Channel Diodes for Enhanced Breakdown Voltage and Switching Characteristics. [PDF]
Nanomaterials (Basel)Wang P +10 more
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Advances in High-Voltage Power Electronics Using Ga<sub>2</sub>O<sub>3</sub>-Based HEMT: Modeling. [PDF]
Materials (Basel)Alhasani R +4 more
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A remote laboratory for microelectronics fabrication
2008 38th Annual Frontiers in Education Conference, 2008During the last decade there has been a move towards using remote laboratories in engineering education. These labs allow students to control either electrical or mechanical systems remotely via the internet. At the University of South Australia (UniSA), we have been developing a remote lab that will allow users to visually inspect and test ...
Aaron Mohtar, Zorica Nedic, Jan Machotka
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Electrically Insulative Adhesives for Hybrid Microelectronic Fabrication
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1977The use of insulative adhesives for attachment of alumina substrates to metallic headers is gaining considerable interest in the areas of hybrid microcircuit fabrication. However, many unresolved problems concerning long-term reliability of hybrid circuits using organic materials continues to plague the industry. Thus, the purposes of the investigation
G. W. Brassell, D. R. Fancher
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The Microelectronics Fabrication of VHF Systems
IEEE Transactions on Aerospace, 1965The need for microelectronics in aerospace systems arises from demands for increased reliability and payload. Much existing equipment can be converted to microelectronics without extensive redesign, without sacrificing reliability, and without increasing circuit fabrication costs.
M. Shannon, D. L. Cannon
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Design And Fabrication Of Microelectronic Lenses
SPIE Proceedings, 1980Programs written to assist in the design and evaluation of microelectronic lenses are briefly described. Over the past 15 years, several families of lenses were designed using these programs. Basically, the higher order aberrations are mapped for a series of similar designs with corrected Seidel aberrations.
R. E. Tibbetts, J. S. Wilczynski
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Focused Ion Beams in Microelectronic Fabrication
IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983For more than 20 years the designers and fabricators of integrated circuits and microstructure devices have strived toward smaller features as a means of achieving higher packing density, better performance, and lower cost. The new field of microlithography has emerged as a result of these pressures.
J. Doherty, B. Ward, E. Kellogg
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Laser Diagnostics of Microelectronics Fabrication Processes
MRS Proceedings, 1988AbstractLaser diagnostics, including long path infrared diode laser absorption and dye laser induced fluorescence, are able to provide microscopic information on the gas phase of such important semiconductor fabrication processes as plasma etching and plasma enhanced deposition.
J. Wormhoudt, K. McCurdy, A. Freedman
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On Microelectronic Components, Interconnections, and System Fabrication
Papers presented at the May 3-5, 1960, western joint IRE-AIEE-ACM computer conference on - IRE-AIEE-ACM '60 (Western), 1960Microelectronic data processing systems are analyzed and various requirements for components are considered. The rapid reduction in transmission line cross section upon scaling down causes increased losses in microelectronic systems thus giving rise to the need for high impedance components for non-cryogenic applications.
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