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Novel manufacturing technology for microelectronic packaging fabrication
Proceedings of IEEE 43rd Electronic Components and Technology Conference (ECTC '93), 2002Flexible, quick turn around and high density interconnection circuit patterning capabilities are key for packaging manufacturing as the industry grows at an increasingly competitive and faster pace. A novel fabrication technology for multilayer ceramic (MLC) packaging has been investigated and developed to meet these challenges.
null You-Wen Yau +2 more
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Emulation and Simulation of Microelectronic Fabrication Processes
2022Die Herstellung von immer leistungsstärkeren Mikroprozessoren durch die Verkleinerung von Transistoren ist bereits seit den 1950 er Jahren ein Haupttreiber für technologischen Fortschritt in fast allen Bereichen. Bis vor Kurzem konnte diese Verkleinerung hauptsächlich durch bessere Kontrolle von Prozessbedingungen und ohne drastische Änderungen der ...
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Microelectronics technology—a look at fabrication methods
Microelectronics Reliability, 1967Size, cost, reliability and circuit performance are the features which determine what types of integrated circuit should be used, and what methods should be used in their manufacture.
R.I. Walker, R. Naylor
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Design and fabrication of hermetic microelectronic implants
1st Annual International IEEE-EMBS Special Topic Conference on Microtechnologies in Medicine and Biology. Proceedings (Cat. No.00EX451), 2002Micromodular electrical stimulators called BIONs/sup TM/ (BIOnic Neurons) are injected into paralyzed muscles to treat disuse atrophy. The small, narrow shape required novel solutions to address requirements for wireless power and data transmission, electromechanical assembly and biocompatible hermetic packaging.
G.E. Loeb +3 more
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Fabrication Techniques and an Introduction to Microelectronics
1983Chapter 7 covered the basic physics of semiconductor devices, and just touched on the methods used to manufacture the components themselves. Semiconductor manufacture, or ‘fabrication’ as it is more generally called in the industry, is a highly specialised and very difficult subject, but it is useful for the electronics engineer or technician to have ...
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Wafer-Scale Multilayer Fabrication for Silk Fibroin-Based Microelectronics
ACS Applied Materials & Interfaces, 2018Silk fibroin is an excellent candidate for biomedical implantable devices because of its biocompatibility, controllable biodegradability, solution processability, flexibility, and transparency. Thus, fibroin has been widely explored in biomedical applications as biodegradable films as well as functional microstructures.
Geon Kook +7 more
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Neural net development: implications of microelectronics fabrication technology
Proceedings., Eighth University/Government/Industry Microelectronics Symposium, 2003A brief historical and technological perspective on neural networks is presented along with emphasis on DARPA (Defense Advanced Research Projects Agency) interest in this area. The authors describe the DARPA format they believe is a very appropriate one to bring into perspective the diverse interests and capabilities, requirements; research, proposals,
A. Ferry, D. Komisky
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Laser-based microscale bending for microelectronics fabrication
SPIE Proceedings, 2000This paper presents experimental and theoretical work on laser-based microscale bending. High precision bending of stainless steel and ceramic specimens is achieved with the use of a pulsed or a CW laser. Experiments are conducted to study the bending behavior of stainless steel and ceramics due to laser irradiation. The amount of bending is correlated
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New trends in microelectronics fabrication technology-1965
IRE International Convention Record, 2005A number of significant new developments in silicon monolithic microcircuit fabrication technology have emerged during the past year. Of particular importance are improved thin-film over silicon components, methods for incorporating insulating and conducting layers within the semiconductor, localized epitaxial growth, ultra small geometry techniques ...
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Importance of Interfaces in Microelectronic Device Fabrication
1987Microelectronic device fabrication currently relies totally upon photoresist processing for pattern delineation in integrated circuit fabrication. Adhesion of polymeric photoresist patterns, especially those of submicron dimensions, to the various substrates encountered is therefore of paramount importance. Poor photoresist adhesion has been cured by a
J. N. Helbert +3 more
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