Results 131 to 140 of about 185,781 (197)

Computational Predictions and Microwave Plasma Synthesis of Superhard Boron-Carbon Materials. [PDF]

open access: yesMaterials (Basel), 2018
Baker PA   +6 more
europepmc   +1 more source

Direct Synthesis of Large-Area Graphene on Insulating Substrates at Low Temperature using Microwave Plasma CVD. [PDF]

open access: yesACS Omega, 2019
Vishwakarma R   +7 more
europepmc   +1 more source
Some of the next articles are maybe not open access.

Related searches:

Plasma microwave electronics

Soviet Physics Uspekhi, 1981
The theory of Cherenkov and cyclotron plasma sources of coherent microwave radiation excited by intense electron beams is reviewed systematically. The linear approximation of the theory yields the output frequency spectra, the wave growth rates, and the threshold electron beam currents required for exciting these sources.
L.S. Bogdankevich   +2 more
openaire   +1 more source

Microwave Plasma Carburizing

2016
Thermochemical treatments carried out in microwave plasma are applied to steel substrates to increasehardness and prevent corrosion and simultaneously improve wear resistance. They are efficient for steelcarburizing. Since they are electrodeless process, the steel is free from metallic sputtering.
Jauberteau, Isabelle   +1 more
openaire   +3 more sources

Microwave plasma varactors

1966 International Electron Devices Meeting, 1966
A low-loss, low-noise plasma varactor has been developed. This is a variable microwave reactance produced by means of a low pressure, highly efficient gas discharge. This device compares favorably with ferrite or semiconductor devices as far as rf losses and average rf power handling capability are concerned. A low-loss phase shifter has been developed
J.Y. Wada, R.C. Knechtli, B.J. Forman
openaire   +1 more source

Microwave Plasma Etching

Japanese Journal of Applied Physics, 1977
A new plasma etching technique using microwave discharge is presented. Silicon wafers are etched by the discharge in a (CF4+O2) gas mixture. Fine patterns with dimensions of 1 µm are etched up to 1 µm in depth without undercutting at a pressure of 5×10-4 Torr with an Al mask having 0.08 µm thickness.
Keizo Suzuki   +3 more
openaire   +1 more source

Home - About - Disclaimer - Privacy