Results 211 to 220 of about 15,098,358 (286)

Toward Perception‐Native Electronic Skin: Bio‐Inspired In‐/Near‐Sensor and Neuromorphic Computing for Humanoid Robots

open access: yesAdvanced Materials Technologies, EarlyView.
Dense tactile streams from across the humanoid body converge on collide in a central wiring and data bottleneck. By relocating computation closer to and then into the skin itself, near‐ and in‐sensor architectures, together with neuromorphic computing, chart a path toward perception‐native electronic skin, in which the conversion of stimulus into ...
Mijin Kim   +6 more
wiley   +1 more source

Biodegradable and Edible Milli‐Fluidic Logic Circuits

open access: yesAdvanced Materials Technologies, EarlyView.
Fully biodegradable and edible fluidic circuits are developed using gelatin‐based valves that operate at low pressure. Logic gates, a one‐bit memory, and a ring oscillator are demonstrated, showing that biodegradable materials can perform computation and control.
Shuhang Zhang   +3 more
wiley   +1 more source

Liquid Metal Resistive Sensing Architectures for Measuring Diaphragm Strain Responses on Obstructed Surfaces

open access: yesAdvanced Materials Technologies, EarlyView.
A liquid metal‐based strain‐sensing architecture to measure the deformation of a circular diaphragm against obstructed surfaces is formulated using finite element modeling and confocal imaging to establish the mechanical framework and is utilized to control diaphragm‐induced confinement on a bead array, as validated by biomolecular loading level ...
Abdullah‐Bin Siddique   +4 more
wiley   +1 more source

Spatially Configurable Conformal Sensor Integration on an Ultra‐Fine Metallic Needle for Minimally Invasive Deep‐Tissue Oxygen Monitoring

open access: yesAdvanced Materials Technologies, EarlyView.
A multi‐point oxygen‐sensing ultra‐fine needle (MO‐UFN) is developed by conformally integrating a lithographically patterned flexible electrochemical sensor array onto a clinical acupuncture needle. The platform preserves an approximately 0.3 mm diameter while enabling spatially resolved oxygen profiling along the insertion pathway.
Yeju Seo   +9 more
wiley   +1 more source

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na   +7 more
wiley   +1 more source

Home - About - Disclaimer - Privacy