Results 161 to 170 of about 1,467,405 (268)

Microenvironment Modulation‐Based Nanomaterial‐Loaded Hydrogel Dressings for Diabetic Foot Ulcers: Research Progress and Future Perspectives

open access: yesAdvanced Materials Interfaces, EarlyView.
xx xx. ABSTRACT Diabetic foot ulcer (DFU) is a chronic complication of diabetes, primarily caused by hyperglycemia, peripheral vascular disease, and neuropathy. Characterized by persistent hyperglycemia, impaired perfusion, inflammation, and infection, DFUs pose significant challenges to healing and are associated with high morbidity and amputation ...
Tang Yuqing   +5 more
wiley   +1 more source

Nonmulberry Silk Fibroin Doping Boosts Charge Transfer and Charge Injection in Aligned Polypyrrole‐Silk Scaffolds for Low‐Voltage Neurostimulation

open access: yesAdvanced Materials Interfaces, EarlyView.
Conductive silk‐polypyrrole scaffolds couple redox stability with cell‐affinitive peptides present innately in an endogenous silk fibroin, enabling optimized electrical stimulation to drive neurite outgrowth. Findings establish electrochemical‐biological link for biomaterial design rules for smart nerve guidance conduits that can provide low voltage ...
Rajiv Borah   +5 more
wiley   +1 more source

Digital Mobile Communications. Application of Mobile Communications.

open access: yesThe Journal of the Institute of Television Engineers of Japan, 1995
openaire   +2 more sources

Tunable Sensitivity in PAN/CNF/PEDOT:PSS Nanofiber‐Based Piezocapacitive Sensors

open access: yesAdvanced Materials Interfaces, EarlyView.
This study demonstrates highly tunable, flexible pressure sensors made from a nanofibrous composite of polyacrylonitrile (PAN) and carbon nanofibers (CNF) or poly(3,4‐ethylenedioxythiophene):polystyrene sulfonate (PEDOT:PSS). By adjusting filler type, concentration, and mat thickness, the sensors achieve large sensitivity improvements, stable ...
Alireza Gholamhoseini   +4 more
wiley   +1 more source

Multimedia Mobile Communication System. Multimedia Mobile Communications.

open access: yesThe Journal of The Institute of Electrical Engineers of Japan, 1996
openaire   +2 more sources

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Transient Liquid Phase (TLP) bonding is gaining traction as a lead‐free die‐attach technology in power electronics packaging. This review examines the state of TLP bonding, its key elements, reliability aspects, and practical limitations. This review also highlights emerging trends, such as nanostructured interfaces, that may improve scalability of TLP
Fatin Battal   +4 more
wiley   +1 more source

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