Results 201 to 210 of about 20,000 (231)
Some of the next articles are maybe not open access.
2009
Les mémoires non-volatiles et plus spécialement les mémoires Flash sont de plus en plus utilisées dans le contexte SoC. Cet article présente une étude préliminaire des mécanismes de défaillances pouvant affecter les mémoires Flash NAND.
Mauroux, Pierre-Didier +5 more
openaire +1 more source
Les mémoires non-volatiles et plus spécialement les mémoires Flash sont de plus en plus utilisées dans le contexte SoC. Cet article présente une étude préliminaire des mécanismes de défaillances pouvant affecter les mémoires Flash NAND.
Mauroux, Pierre-Didier +5 more
openaire +1 more source
Evolution of NAND Flash Memory Interface
2007In this paper, we describe the basics of NAND flash memory and describe the evolution of its interface to facilitate easy integration, to provide high bandwidth, to offer disk-like interface, and/or to guarantee interoperability.
Sang Lyul Min +2 more
openaire +1 more source
Reliability issues of NAND Flash memories
2010The continuous demand for NAND flash memories with higher performance and storage capabilities pushes the manufactures towards the limits of present technologies and to explore new solutions, both from the physical and the architectural point of view.
C. Zambelli, A. Chimenton, P. Olivo
openaire +1 more source
Reliability of NAND Flash Memories
2010The continuous demand for NAND flash memories with higher performance and storage capabilities pushes the manufactures towards the limits of present technologies and to explore new solutions, both from the physical and the architectural point of view. The memory reliability represents one of the major antagonist towards this un-stoppable technological ...
ZAMBELLI, Cristian +2 more
openaire +1 more source
3D VG-Type NAND Flash Memories
2016The common feature among the different 3D NAND solutions is constituted by very deep vertical (z direction) etching steps that define the Flash cells geometries simultaneously. Transistor geometries are formed by the deep trench through a multiple polysilicon/oxide stack.
openaire +1 more source
Review of Semiconductor Flash Memory Devices for Material and Process Issues
Advanced Materials, 2023Seung Soo Kim +2 more
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