Results 171 to 180 of about 228,562 (313)

Transducers Across Scales and Frequencies: A System‐Level Framework for Multiphysics Integration and Co‐Design

open access: yesAdvanced Materials Technologies, EarlyView.
Transducers convert physical signals into electrical and optical representations, yet each mechanism is bounded by intrinsic trade‐offs across bandwidth, sensitivity, speed, and energy. This review maps transduction mechanisms across physical scale and frequency, showing how heterogeneous integration and multiphysics co‐design transform isolated ...
Aolei Xu   +8 more
wiley   +1 more source

Passive Shape‐Adaptive Fluidic Interface for Enhanced Skin‐Sensor Coupling in Wearable Devices

open access: yesAdvanced Materials Technologies, EarlyView.
This study presents a passive fluidic interface for wearable biosensors that adapts to static and dynamic body shape changes to maintain consistent skin contact. Flexible, fluid‐filled pouches redistribute pressure from high‐load areas to regions requiring improved contact, enhancing signal quality and comfort in a compact, low‐energy design for ...
Natalia Sanchez‐Tamayo   +6 more
wiley   +1 more source

A weighted (p,2)-equation with double resonance

open access: yesElectronic Journal of Differential Equations, 2023
Zhenhai Liu, Nikolaos S. Papageorgiou
doaj  

Fabric‐Based Wearable Robotic Exoskeleton Gloves: Advancements and Challenges

open access: yesAdvanced Materials Technologies, EarlyView.
This review highlights interdisciplinary technological advances in fabric‐based robotic gloves, focusing on progress in design, fabrication, actuation, sensing, control, and power and energy requirements. It also addresses performance testing and validation, including biomechanical, strength, functional, user experience, and durability assessments, to ...
Ayse Feyza Yilmaz   +2 more
wiley   +1 more source

In Situ Copper Electroplating Turns Material Extrusion 3D Printers Into Metal–Polymer Hybrid Fabricators

open access: yesAdvanced Materials Technologies, EarlyView.
An in situ electroplating approach for MEX 3D printing is proposed, enabling copper deposition during the fabrication of conductive polymers. The method combines a printer‐integrated plating head, ML‐based g‐code control, and stop‐and‐go printing, achieving near‐bulk copper conductivity and enabling fully embedded, assembly‐free electronic components ...
Gianluca Percoco   +5 more
wiley   +1 more source

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