Results 71 to 80 of about 571 (183)
Properties of Novolac/Epoxy Alloy Resins Prepared from Liquefied Cryptomeria Japonica Wood
, 2018 本研究將柳杉（Cryptomeria japonica; Japanese cedar）木材以酚或酚/雙酚 A 為溶劑，H2SO4 為催化劑進行液化處理，並將液化柳杉及酚分別與福馬林反應合成 Novolac 型酚醛樹脂（Phenol-formaldehyde resin; PF），另以雙酚 A 與環氧氯丙烷 反 應 合 成 環 氧 樹 脂 ； 並 將 Novolac 樹 脂 與 環 氧 樹 脂 混 合 製 備 摻 合 樹 脂 （Polyblending resin），或與環氧氯丙烷反應製備環氧化 PF ...
朱建芳, Chien-Fang Chu
core
Nitrile‐containing imidazole cured of novolac epoxy resin [PDF]
Journal of Applied Polymer Science, 1991 Jun‐Lin Fan +2 more
openaire +1 more source
Obtenção e estudo da miscibilidade de blendas binarias de poliamidas com oligomeros ou copolimeros [PDF]
, 1995 Dissertação (Mestrado) - Universidade Federal de Santa Catarina, Centro de Ciências Físicas e Matemáticas.No estudo de blendas poliméricas (a mistura física de dois ou mais polímeros) podem-se obter novos materiais com propriedades diferentes dos ...
Maggioni, Jair Francisco
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液化柳杉木材製備 Novolac/Epoxy 複合系樹脂之性質
, 2018 本研究將柳杉（Cryptomeria japonica; Japanese cedar）木材以酚或酚/雙酚 A 為溶劑，H2SO4 為催化劑進行液化處理，並將液化柳杉及酚分別與福馬林反應合成 Novolac 型酚醛樹脂（Phenol-formaldehyde resin; PF），另以雙酚 A 與環氧氯丙烷 反 應 合 成 環 氧 樹 脂 ； 並 將 Novolac 樹 脂 與 環 氧 樹 脂 混 合 製 備 摻 合 樹 脂 （Polyblending resin），或與環氧氯丙烷反應製備環氧化 PF ...
朱建芳, Chien-Fang Chu
core
Structural modification of epoxy resins by a liquid elastomer
, 1994 A carboxy terminated poly-n-(butyl acrylate, acrylic acid, acrylonitryl) (PNBA) terpolymer was used as a modifier for three high-functionality epoxy resins, (i) epoxy novolac, (ii) triglycidyl-4-aminophenol (TGPAP) and (iii) tetraglycidyl diaminodiphenyl
Rao, RMVGK, Subramaniam, C, Padma, A
core +1 more source
, 2011 In this study a series of modified bisphenol-A type novolac epoxy resins (MNEPs) were synthesized from bisphenol-A type novolac epoxy resin (NEP) and propionic acid (PA) by a one-step ring-opening reaction process in the presence of tetramethylammonium ...
Xiufang Wen +7 more
core +1 more source
, 2019 In this study, the adhesion strength of three epoxy resins, which are used as basic materials for epoxy molding compound (EMC) in microelectronics, to copper leadframe was determined using the peel test. The epoxy resins used were O-cresol Novolac (OCN),
Cho, EC, Park, CE, Cho, K
core +1 more source
, 2014 : This paper reports on polydopamine and polyamine surface modifications of an etched epoxy cresol novolac (ECN) resin using the `grafting to' method.
Vanfleteren, Jan +5 more
core +1 more source
Investigating the effect of curing temperature on the corrosion resistance of epoxy-based composite coatings for aluminium alloy 7075 in artificial seawater. [PDF]
RSC Adv, 2023 Khan AA, Khan A, Zafar Z, Ahmad I.
europepmc +1 more source
Effect of Thermomechanical Loading at Low Temperatures on Damage Development in Glass Fiber Epoxy Laminates. [PDF]
Materials (Basel), 2023 Krzak A +3 more
europepmc +1 more source