Results 221 to 230 of about 8,958,149 (314)

Phosphorylated Toll-like receptor 3 nuclear translocation in cancer cell promotes metastasis and chemoresistance. [PDF]

open access: yesSignal Transduct Target Ther
Wang Z   +8 more
europepmc   +1 more source

First‐Principles Modeling of Solid Solution Softening and Hardening Effects in Al–Mg–Zr–Si Aluminum Alloys

open access: yesAdvanced Engineering Materials, EarlyView.
The role of various alloying elements in face‐centered cubic aluminum on the barrier of a Shockley partial dislocation during its motion is presented. The study aims to understand how alloying atoms such as Mg, Si, and Zr affect the energy landscape for dislocation motion, thus influencing the solid solution hardening and softening in aluminum, which ...
Inna Plyushchay   +3 more
wiley   +1 more source

Elaboration of molecular glues that target TRIM21 into TRIMTACs that degrade protein aggregates. [PDF]

open access: yesNat Commun
Scemama de Gialluly MA   +7 more
europepmc   +1 more source

β-delayed particle decay of 9C and the A = 9, T = 1/2 nuclear system: Experiment, data, and phenomenological analysis

open access: green, 2000
E. Gete   +13 more
openalex   +2 more sources

Neutrino experiments at nuclear reactors [PDF]

open access: yesProceedings of Flavor Physics and CP Violation — PoS(FPCP2016), 2017
openaire   +1 more source

A Simulative Approach for the Prediction of Mesoscale Residual Stress Fields in Solution‐Strengthened Ferritic Ductile Iron

open access: yesAdvanced Engineering Materials, EarlyView.
This study presents a 3D representative volume element‐based simulation approach to predict mesoscopic residual stress and strain fields in silicon solid solution‐strengthened ductile cast iron. By modeling phase transformation kinetics with an enhanced Johnson–Mehl–Avrami–Kolmogorov model, the effects of varying cooling rates on residual stresses are ...
Lutz Horbach   +6 more
wiley   +1 more source

Secreted lumican from the tumor microenvironment potentiates HCC stemness and progression. [PDF]

open access: yesHepatol Commun
Chan KK   +10 more
europepmc   +1 more source

Wafer Bonding Technologies for Microelectromechanical Systems and 3D ICs: Advances, Challenges, and Trends

open access: yesAdvanced Engineering Materials, EarlyView.
This review explores wafer bonding technologies, covering wafer preparation, activation methods, and bonding mechanisms. It compares direct and indirect bonding, highlights recent advancements and future trends, and examines applications in 3D integration and packaging.
Abdul Ahad Khan   +5 more
wiley   +1 more source

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