Results 171 to 180 of about 415,467 (290)

Multivariate connectivity deviations reveal task-evoked and clinical network reorganization. [PDF]

open access: yesiScience
Kröll JP   +8 more
europepmc   +1 more source

Recent Advances of Slip Sensors for Smart Robotics

open access: yesAdvanced Materials Technologies, EarlyView.
This review summarizes recent progress in robotic slip sensors across mechanical, electrical, thermal, optical, magnetic, and acoustic mechanisms, offering a comprehensive reference for the selection of slip sensors in robotic applications. In addition, current challenges and emerging trends are identified to advance the development of robust, adaptive,
Xingyu Zhang   +8 more
wiley   +1 more source

Hierarchical Multi‐Material Architectures With Gradient Design for Dynamic‐Range Flexible Tactile Sensing

open access: yesAdvanced Materials Technologies, EarlyView.
Hierarchical multi‐material TPMS lattices are engineered as flexible tactile sensors by combining soft and stiff elastomeric layers with a conformal conductive coating. The bilayer architecture delivers sensitivity at low pressures while maintaining a broad detectable range under large loads, enabling reliable pressure and vibration monitoring for ...
Reza Noroozi   +3 more
wiley   +1 more source

Toward Perception‐Native Electronic Skin: Bio‐Inspired In‐/Near‐Sensor and Neuromorphic Computing for Humanoid Robots

open access: yesAdvanced Materials Technologies, EarlyView.
Dense tactile streams from across the humanoid body converge on collide in a central wiring and data bottleneck. By relocating computation closer to and then into the skin itself, near‐ and in‐sensor architectures, together with neuromorphic computing, chart a path toward perception‐native electronic skin, in which the conversion of stimulus into ...
Mijin Kim   +6 more
wiley   +1 more source

In‐House Manufacturing of 3D ECM Culture Chips via Vacuum Thermoforming for Enhanced Imaging Applications

open access: yesAdvanced Materials Technologies, EarlyView.
Desktop vacuum thermoforming enables rapid, low‐cost fabrication of 96‐channel polystyrene culture chips with very thin imaging interfaces. The resulting platform supports cell lines, primary cells, and patient‐derived organoids, and enables high‐resolution confocal microscopy and single‐cell visualization, providing an accessible approach for advanced
Aleksandra Fomina   +5 more
wiley   +1 more source

Multidimensional Heat‐Path Engineering in Thermal Interface Materials for High‐Performance Electronics

open access: yesAdvanced Materials Technologies, EarlyView.
This review presents multidimensional heat‐path engineering for thermal interface materials, showing how internal heat transport, interfacial contact and bondline formation, and processing‐defined pathway architectures together determine bonded‐joint thermal performance.
Jinsoo Na   +7 more
wiley   +1 more source

Introduction

open access: yesJournal of Open, Flexible and Distance Learning, 2011
Ben Kehrwald
doaj  

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