Results 121 to 130 of about 7,271 (261)
Average distance between the processors of biswapped networks. [PDF]
Prabhu S +3 more
europepmc +1 more source
AI‐Assisted Workflow for (Scanning) Transmission Electron Microscopy: From Data Analysis Automation to Materials Knowledge Unveiling. Abstract (Scanning) transmission electron microscopy ((S)TEM) has significantly advanced materials science but faces challenges in correlating precise atomic structure information with the functional properties of ...
Marc Botifoll +19 more
wiley +1 more source
Heterogeneous Integration Technology Drives the Evolution of Co-Packaged Optics. [PDF]
Gao H, Yan W, Zhang D, Yu D.
europepmc +1 more source
Highly water‐soluble dicationic bis(indolium) dyes have been prepared, showing excellent two‐photon absorption and light emission. Their fluorescence behavior discloses an unusual increasing blue shift with increasing solvent polarity, which, in parallel, is beneficial for enhanced detection in biological media.
Carlos Benitez‐Martin +5 more
wiley +1 more source
Resolving the Structural Duality of Graphene Grain Boundaries
Cantilever ncAFM resolves the atomic structure of grain boundaries in graphene, revealing coexisting stable and metastable types. Both contain pentagon/heptagon defects, but metastable GBs show irregular geometries. Modeling shows metastable GBs form under compression, exhibiting vertical corrugation, while stable GBs are flat.
Haojie Guo +11 more
wiley +1 more source
Novel single stage multipath 8 × 8 interconnection network/switching element (SSMIN/E) architecture. [PDF]
Gupta S +4 more
europepmc +1 more source
Solvent‐Free Thermal Defect Engineering in Molecular Frameworks With Volatile Linkers
Thermal removal of neutral volatile linkers enables precise and solvent‐free generation of metal vacancies in MOFs. This strategy affords redox‐stable, coordinatively unsaturated FeII sites with tunable spin, ligand coordination, and catalytic behavior. The approach offers a general route to design defect‐functional materials through local coordination
Sonia Martínez‐Giménez +9 more
wiley +1 more source
Wafer-Level Transfer of GaN-on-Si Light-Emitting Devices via SiO<sub>2</sub>-SiO<sub>2</sub> Direct Bonding: Strain Evolution and Optoelectronic Performance. [PDF]
Zhang S, Zhang S, Fan Q, Ni X, Gu X.
europepmc +1 more source
Ordered three‐dimensional anodic aluminum oxide (3D‐AAO) nanoarchitectures with longitudinal and transverse pores enable architecture‐driven metamaterials. The review maps fabrication advances, including hybrid pulse anodization, and shows how 3D‐AAO templates tailor properties across magnetism, energy, catalysis, and sensing.
Marisol Martín‐González
wiley +1 more source
Large-scale silicon photonics switches for AI/ML interconnections based on a 300-mm CMOS pilot line. [PDF]
Suzuki K +5 more
europepmc +1 more source

