Results 141 to 150 of about 2,277,534 (295)
Liquid–liquid interface assembly enables the fabrication of solution‐processed MoS2 and WSe2 centimeter‐scale, nanometer‐thick type‐II heterostructures on paper. Interfacial charge separation and hopping‐limited recombination produce rectification and persistent photocharge retention at zero bias.
Aniello Pelella +11 more
wiley +1 more source
Optical Interconnection Networks Based on Microring Resonators [PDF]
Cuda, Davide +15 more
core +1 more source
Light irradiation activates the Fe2O3‐BiVO4 heterostructure, enabling efficient solar‐electrochemical coupling in zinc‐air batteries. The built‐in electric field drives directional charge separation, guiding photoelectrons toward oxygen reduction sites and accumulating holes for oxygen evolution, thereby reducing polarization and enhancing discharge ...
Yili Liu +7 more
wiley +1 more source
Out‐of‐Plane Strain‐Decoupled Architecture for High‐Fill‐Factor Stretchable OLED Displays
A vertically decoupled multilayer SOLED architecture separates emissive pixel islands from deformable interconnects, allowing low‐modulus elastomeric layers to accommodate applied strain and suppress strain transfer to the OLED region. This design, combined with transparent hybrid encapsulation, enables a high fill factor (∼75%), stretchability ...
Young Hyun Son +2 more
wiley +1 more source
Interconnection Issues on 4G networks
andled by mobile operators that have already developed such core competences. The new integrated market includes many players coming from the legacy markets of telecommunications and the Internet.
Interconnection Will Be
core
BSA addition to physiological solutions enhances resistance of a Zn alloy to stress corrosion cracking (SCC) but reduces its corrosion resistance. Extended surface characterization explains the contrasting influences on corrosion and SCC. Unexpectedly, the alloy suffers transgranular SCC (TGSCC), despite extensive grain boundary precipitation. Thorough
RK Singh Raman +9 more
wiley +1 more source
Advanced Electronic Packaging Technologies: A Comparative Review of Architectures, Applications, Reliability. [PDF]
Huang Y, Wang D, Li Q, Pan Z.
europepmc +1 more source
A geometry‐reconfigured additive manufacturing strategy converts planar printed soft materials into soft compact neural probes with integrated hydrogel electrodes and microfluidic channels. The resulting NeuroMAP platform enables scalable multichannel recording, localized chemical delivery, stable in vivo electrophysiological recording, and reduced ...
Hyunjin Lee +15 more
wiley +1 more source
Gas-permeable and stretchable nanoscale anisotropic conductive film for room-temperature, pressure-free interconnections. [PDF]
Katayama S +8 more
europepmc +1 more source
A degradable, skin‐conformal bioelectronic patch combines a starch‐dominated nanocomposite conductor with a gelatin substrate to enable sensitive strain sensing, high‐fidelity electrocardiography, electromyography, electrooculography, and machine‐learning‐assisted gesture control.
Ming Dong +10 more
wiley +1 more source

