Results 91 to 100 of about 2,218,038 (298)

Chip-Level 1 $\times$ 2 Optical Interconnects Using Polymer Vertical Splitter on Silicon Substrate

IEEE Photonics Journal, 2014
The chip-level 1 × 2 optical interconnects using the polymer vertical splitter developed on a silicon substrate are demonstrated. The 1 × 2 vertical-splitting configuration is realized using a polymer waveguide terminated at three silicon ...
Chin-Ta Chen, Po-Kuan Shen, Teng-Zhang Zhu, Chia-Chi Chang, Shu-Shuan Lin, Mao-Yuan Zeng, Chien-Yu Chiu, Hsu-Liang Hsiao, Hsiao-Chin Lan, Yun-Chih Lee, Yo-Shen Lin, Mount-Learn Wu   +11 more
doaj   +1 more source

Integration of OpenCV‐Based Microscopic Adhesive Volume Measurement Into a Pyiron Workflow for Automated Data Analysis

Advanced Engineering Materials, EarlyView.
Residual adhesive after electrode loading in adhesive‐assisted resistance spot welding is quantified through a traceable experimental‐to‐digital workflow. Chromatic confocal topography provides calibrated surface‐height data, while OpenCV detects the electrode imprint and integrates adhesive height into comparable volume metrics.
Sung‐Min Wi, Jiangdong Zhao
wiley   +1 more source

Adaptive Foam 3D Printing of Ultralight and Multifunctional Materials

Advanced Engineering Materials, EarlyView.
Adaptive foam 3D printing, enabled by expandable microspheres, imparts cellular structures to thermoplastic and thermosetting polymers, manufactured through a variety of processes including fused filament fabrication, direct ink writing, digital light processing, and inkjet printing.
Nariman Rajabifar, Amir Ameli
wiley   +1 more source

Results of the Optical Downlink Experiment KIODO from OICETS Satellite to Optical Ground Station Oberpfaffenhofen (OGS-OP) [PDF]

, 2007
Optical LEO downlinks from the Japanese OICETS to the optical ground station built by the German Aerospace Center (DLR) near Munich have been performed. This was the first optical LEO downlink on European grounds.
Perlot, Nicolas, Giggenbach, Dirk, Takayama, Yoshihisa, Horwath, Joachim, N. Perlot, Brechtelsbauer, Martin, Y. Takayama, Knapek, Markus, D. Giggenbach, Jono, Takashi, J. Horwath, M. Brechtelsbauer, T. Jono, M. Knapek   +13 more
core   +1 more source

Supporting AI Readiness Through Digital Workflows in Materials Science

Advanced Engineering Materials, EarlyView.
Digitalization drives innovation in materials science by connecting data silos and turning heterogeneous processes into reusable research pipelines. Across 13 MaterialDigital projects, digital workflows reveal complementary pathways toward AI‐ready materials research, founded on structured data, persistent artifacts, executable orchestration, and ...
Marian Bruns, Lateef Abdul, Stephan Barth, Martin Glauer, Manuel Günther, Fabian Neuhaus, Jan‐Ole Perschewski, Thomas Bjarsch, Henrik Abel, Johannes Bosch, Niklas Meyer, Peter Hofmann, Marc Drechsler, Alexander Dyck, Dhanunjaya Kumar Nerella, Marvin Tegeler, Oleg Shchyglo, Ingo Steinbach, Timo Klecker, Henk Birkholz, Ehsan Borzabadi Farahani, Bernard Fedelich, Cetin Haftaoglu, Tarakeshwar Lakshmipathy, Elena Garcia Trelles, Christoph Schweizer, Reza Darvishi Kamachali, Lukas Koschmieder, Janin Eiken, Markus Apel, Sung‐Min Wi, Jiangdong Zhao, Andreas Fezer, Nicolas Christ, Patrick Schneider, Eldor Urinov, Veit Königer, Volker Knoblauch, Janik Harter, Thomas Seifert, Thitichai Janpheng, Florian Fuchs, Fabian Teichert, Jörg Schuster, Anke Bardehle, Andreas Limper, Ulrich Giese, Carlos Lucke, Mario Beiner, Christoph Gögelein, Lisa Leuchtenberger‐Engel, Christian Hopmann, Felix Wentzien, Heike Wittek, Benjamin Klie, Alexander Röhrs, Ludger Overmeyer, Achraf Atila, Marcel Sadowski, Leopold Talirz, Jan Janssen, Jesper R. Pedersen, Peter Beck, Tejs Vegge, Ivano E. Castelli, Wolfgang Wenzel, Tilmann Hickel, Jörg Schaarschmidt   +67 more
wiley   +1 more source

A 5 × 200 Gbps microring modulator silicon chip empowered by two-segment Z-shape junctions

Nature Communications
Optical interconnects have been recognized as the most promising solution to accelerate data transmission in the artificial intelligence era. Benefiting from their cost-effectiveness, compact dimensions, and wavelength multiplexing capability, silicon ...
Yuan Yuan, Yiwei Peng, Wayne V. Sorin, Stanley Cheung, Zhihong Huang, Di Liang, Marco Fiorentino, Raymond G. Beausoleil   +7 more
doaj   +1 more source

Panel-Scale Reconfigurable Photonic Interconnects for Scalable AI Computation

IEEE Open Journal of the Solid-State Circuits Society
Panel-scale reconfigurable photonic interconnects on a glass substrate up to 500-mm $\times 500$ -mm or larger are envisioned by proposing a novel photonic switch fabric that enables all directional panel-edge-to-panel-edge reach without active ...
Tzu-Chien Hsueh, Bill Lin, Zijun Chen, Yeshaiahu Fainman   +3 more
doaj   +1 more source

Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects

IEEE Photonics Journal, 2016
A six-channel wavelength-division-multiplexed optical transceiver with a compact footprint of 1.5 $\times$ 0.65 mm2 for off-chip and on-chip interconnects is demonstrated on a single silicon-on-insulator chip. An arrayed waveguide grating is used as the
Kaixuan Chen, Qiangsheng Huang, Jianhao Zhang, Jianxin Cheng, Xin Fu, Chenzhao Zhang, Keqi Ma, Yaocheng Shi, Dries Van Thourhout, Gunther Roelkens, Liu Liu, Sailing He   +11 more
doaj   +1 more source

Wideband and Channel Switchable Mode Division Multiplexing (MDM) Optical Power Divider Supporting 7.682 Tbit/s for On-Chip Optical Interconnects. [PDF]

Sensors (Basel), 2023
Hung TY, Chen GH, Lin YZ, Chow CW, Jian YH, Kuo PC, Peng CW, Tsai JF, Liu Y, Yeh CH.   +9 more
europepmc   +1 more source

Laser‐Induced Graphene from Waste Almond Shells

Advanced Functional Materials, EarlyView.
Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova, Anna Chiara Bressi, Marina Galliani, Attilio Marino, Gianni Ciofani, Eduardo Machado‐Charry, Hilda Gomez Bernal, Alessandra Francini, Luca Sebastiani, Francesco Greco   +9 more
wiley   +1 more source