Results 71 to 80 of about 4,554 (261)

Integration of OpenCV‐Based Microscopic Adhesive Volume Measurement Into a Pyiron Workflow for Automated Data Analysis

Advanced Engineering Materials, EarlyView.
Residual adhesive after electrode loading in adhesive‐assisted resistance spot welding is quantified through a traceable experimental‐to‐digital workflow. Chromatic confocal topography provides calibrated surface‐height data, while OpenCV detects the electrode imprint and integrates adhesive height into comparable volume metrics.
Sung‐Min Wi, Jiangdong Zhao
wiley   +1 more source

FPGA-Implemented Fractal Decoder with Forward Error Correction in Short-Reach Optical Interconnects. [PDF]

Entropy (Basel), 2022
Matsenko S, Borysenko O, Spolitis S, Udalcovs A, Gegere L, Krotov A, Ozolins O, Bobrovs V.   +7 more
europepmc   +1 more source

The Influence of Field‐Assisted Sintering Technology (FAST) Temperature and Cooling Rate on the Microstructural Evolution in Gamma‐Titanium Aluminide Alloy GE4822

Advanced Engineering Materials, EarlyView.
Controlling the Field Assisted Sintering Technology (FAST) parameters, dwell temperature and cooling rate, significantly influences the microstructural evolution in titanium aluminide GE4822. Significant γ‐lamellar colonies develop only upon cooling through the α‐transus.
Jack Krohn, James Pepper, Martin Jackson
wiley   +1 more source

Edge-guided inverse design of digital metamaterial-based mode multiplexers for high-capacity multi-dimensional optical interconnect

Nature Communications
The escalating demands of compute-intensive applications urgently necessitate the adoption of optical interconnect technologies to overcome bottlenecks in scaling computing systems.
Aolong Sun, Sizhe Xing, Xuyu Deng, Ruoyu Shen, An Yan, Fangchen Hu, Yuqin Yuan, Boyu Dong, Junhao Zhao, Ouhan Huang, Ziwei Li, Jianyang Shi, Yingjun Zhou, Chao Shen, Yiheng Zhao, Bingzhou Hong, Wei Chu, Junwen Zhang, Haiwen Cai, Nan Chi   +19 more
doaj   +1 more source

Stretching the Printability Metric in Direct‐Ink Writing with Highly Extensible Yield‐Stress Fluids

Advanced Functional Materials, EarlyView.
This study introduces “drawability” as a new metric for assessing printability in direct‐ink writing, focusing on gap‐spanning performance and speed robustness. By designing yield‐stress fluids with high extensibility, we demonstrate that extensional strain‐to‐break significantly enhances printability.
Chaimongkol Saengow, Samya Sen, Joaquin Yus, Eliza E. Lovrich, Amanda G. Hoika, Kelly M. Chang, Arielle A. Pfeil, Nellie Haug, Amy J. Wagoner Johnson, Randy H. Ewoldt   +9 more
wiley   +1 more source

40 Gb/s Mode-Division Multiplexed DD-OFDM Transmission Over Standard Multi-Mode Fiber

IEEE Photonics Journal, 2016
A 40 Gb/s mode-division multiplexed (MDM) direct detection optical frequency-division multiplexing signal transmission over standard multimode OM3 fiber (MMF) has been demonstrated in this paper.
Jiawei Luo, Jianping Li, Qi Sui, Zhaohui Li, Chao Lu   +4 more
doaj   +1 more source

Laser‐Induced Graphene from Waste Almond Shells

Advanced Functional Materials, EarlyView.
Almond shells, an abundant agricultural by‐product, are repurposed to create a fully bioderived almond shell/chitosan composite (ASC) degradable in soil. ASC is converted into laser‐induced graphene (LIG) by laser scribing and proposed as a substrate for transient electronics.
Yulia Steksova, Anna Chiara Bressi, Marina Galliani, Attilio Marino, Gianni Ciofani, Eduardo Machado‐Charry, Hilda Gomez Bernal, Alessandra Francini, Luca Sebastiani, Francesco Greco   +9 more
wiley   +1 more source

Enabling Equalization and Soft Decision by k-Means for VCSEL-Based PAM-4 Optical Interconnection

IEEE Photonics Journal, 2019
As for vertical-cavity surface-emitting lasers (VCSEL)-based optical pulse amplitude modulation (PAM) interconnection system, apart from the universal signal distortions like Gaussian noise and fiber dispersion, direct modulation of VCSEL specially ...
Lin Sun, Jiangbing Du, Ke Xu, Bo Liu, Zuyuan He   +4 more
doaj   +1 more source

Composites of Shellac and Silver Nanowires as Flexible, Biobased, and Corrosion‐Resistant Transparent Conductive Electrodes

Advanced Functional Materials, EarlyView.
Shellac, a centuries‐old natural resin, is reimagined as a green material for flexible electronics. When combined with silver nanowires, shellac films deliver transparency, conductivity, and stability against humidity. These results position shellac as a sustainable alternative to synthetic polymers for transparent conductors in next‐generation ...
Rahaf Nafez Hussein, Tiago Carneiro Gomes, Eliza Ng, Simon Rondeau‐Gagné, Tricia Breen Carmichael   +4 more
wiley   +1 more source

Integration of Low‐Voltage Nanoscale MoS2 Memristors on CMOS Microchips

Advanced Functional Materials, EarlyView.
This article presents the first monolithic integration of nanoscale MoS2‐based memristors into the back‐end‐of‐line of foundry‐fabricated CMOS microchips in a one‐transistor‐one‐resistor (1T1R) architecture. The MoS2‐based 1T1R cells exhibit forming‐free, nonvolatile resistive switching with ultra‐low operating voltages, low cycle‐to‐cycle variability ...
Jimin Lee, Sofía Cruces, Xiaohua Liu, Yang Chen, Vasilis A. Maroufidis, Janghyun Jo, Lukas Völkel, Dennis Braun, Michael Möller, Leon Brackmann, Holger Kalisch, Michael Heuken, Andrei Vescan, Rafal E. Dunin‐Borkowski, Joachim Mayer, Stefan Wiefels, Max C. Lemme   +16 more
wiley   +1 more source