Results 61 to 70 of about 4,554 (261)

Microstructure, Thermal Transport, and Dry‐Sliding Tribology of Powder‐Metallurgy Al7075 Composites Reinforced With Sol–Gel‐Derived ZnO–rGO Hybrid Nanoparticles

Advanced Engineering Materials, EarlyView.
Sol–gel‐derived ZnO–rGO hybrid nanoparticles enable Al7075 powder‐metallurgy composites to achieve concurrent gains in hardness and thermal conductivity while markedly lowering friction and wear. The hybrid architecture couples ZnO‐based load support with rGO‐assisted lamellar sliding and heat spreading, revealing a promising route toward lightweight ...
Bunyamin Aksakal, Cevher Kursat Macit, Merve Ayık, Hakan Tutumlu   +3 more
wiley   +1 more source

Defect Evolution and Mechanical Performance of Fused Filament Fabrication‐Manufactured 17‐4PH Stainless Steel Revealed by X‐Ray Computed Tomography

Advanced Engineering Materials, EarlyView.
X‐ray computed tomography reveals how process‐induced defects evolve from green to sintered states in Fused Filament Fabrication (FFF)‐manufactured 17‐4PH stainless steel. Internal porosity, weakest cross‐sections, and fracture locations show strong correlation with tensile performance, demonstrating the potential of computed tomography (CT)‐based ...
György Ledniczky, Márk Sárközi, Ibolya Zsoldos, Zoltán Weltsch   +3 more
wiley   +1 more source

Extrusion‐Based Additive Manufacturing of Advanced Ceramics: Strengthening Mechanisms and Process Optimization Review

Advanced Engineering Materials, EarlyView.
This review comprehensively evaluates extrusion‐based additive manufacturing for advanced ceramics, detailing feedstock options and key process parameters. By critically addressing defect mechanisms like porosity and cracking, the work highlights optimization strategies through machine learning and advanced postprocessing.
Meisam Bakhtiari, Mohammad Hadi Sheikh‐Ansari, Avinash Borgaonkar, Mehran Dadkhah, Abdollah Saboori   +4 more
wiley   +1 more source

A 5 × 200 Gbps microring modulator silicon chip empowered by two-segment Z-shape junctions

Nature Communications
Optical interconnects have been recognized as the most promising solution to accelerate data transmission in the artificial intelligence era. Benefiting from their cost-effectiveness, compact dimensions, and wavelength multiplexing capability, silicon ...
Yuan Yuan, Yiwei Peng, Wayne V. Sorin, Stanley Cheung, Zhihong Huang, Di Liang, Marco Fiorentino, Raymond G. Beausoleil   +7 more
doaj   +1 more source

52 km-Long Transmission Link Using a 50 Gb/s O-Band Silicon Microring Modulator Co-Packaged With a 1V-CMOS Driver

IEEE Photonics Journal, 2019
We present an O-band silicon microring modulator with up to 50 Gb/s modulation rates, co-packaged with a 1V-CMOS driver in a dispersion un-compensated, transmission experiment through 52 km of standard single-mode fiber.
Miltiadis Moralis-Pegios, Stelios Pitris, Theoni Alexoudi, Hannes Ramon, Xin Yin, Johan Bauwelinck, Yoojin Ban, Peter De Heyn, Joris Van Campenhout, Nikos Pleros   +9 more
doaj   +1 more source

Semantic Modeling in Materials Science and Engineering With Platform MaterialDigital Core Ontology 3.0

Advanced Engineering Materials, EarlyView.
The community‐driven Platform MaterialDigital Core Ontology (PMDco) 3.0 is introduced as a Basic Formal Ontology‐aligned semantic backbone for the processing–structure–properties paradigm in Materials Science and Engineering. Modular engineering, automated releases, and validation workflows are highlighted and key semantic patterns for materials ...
Markus Schilling, Philipp von Hartrott, Jörg Waitelonis, Thomas Hanke, Henk Birkholz, Hossein Beygi Nasrabadi, Khashayar Razghandi, Kamilla Zaripova, Felix Thonagel, Fabian Neuhaus, Martin Glauer, Lars Vogt, Harald Sack, Lutz Mädler, Bernd Bayerlein, Chris Eberl   +15 more
wiley   +1 more source

Panel-Scale Reconfigurable Photonic Interconnects for Scalable AI Computation

IEEE Open Journal of the Solid-State Circuits Society
Panel-scale reconfigurable photonic interconnects on a glass substrate up to 500-mm $\times 500$ -mm or larger are envisioned by proposing a novel photonic switch fabric that enables all directional panel-edge-to-panel-edge reach without active ...
Tzu-Chien Hsueh, Bill Lin, Zijun Chen, Yeshaiahu Fainman   +3 more
doaj   +1 more source

Multilayer Self‐Limiting Electrospray Deposition via Stepped Voltage Bias

Advanced Engineering Materials, EarlyView.
Self‐limiting electrospray deposition (SLED) uses a high voltage to generate and deposit a charged payload on a target surface. The coating retains its charge, repelling newly arriving material. SLED thickness can be decreased by applying a secondary bias to the target.
Madhuri Deb, S. Rahman Pejman, Alexander Jakimowicz, Jonathan P. Singer   +3 more
wiley   +1 more source

Wavelength-Multiplexed Duplex Transceiver Based on III-V/Si Hybrid Integration for Off-Chip and On-Chip Optical Interconnects

IEEE Photonics Journal, 2016
A six-channel wavelength-division-multiplexed optical transceiver with a compact footprint of 1.5 $\times$ 0.65 mm2 for off-chip and on-chip interconnects is demonstrated on a single silicon-on-insulator chip. An arrayed waveguide grating is used as the
Kaixuan Chen, Qiangsheng Huang, Jianhao Zhang, Jianxin Cheng, Xin Fu, Chenzhao Zhang, Keqi Ma, Yaocheng Shi, Dries Van Thourhout, Gunther Roelkens, Liu Liu, Sailing He   +11 more
doaj   +1 more source

Wideband and Channel Switchable Mode Division Multiplexing (MDM) Optical Power Divider Supporting 7.682 Tbit/s for On-Chip Optical Interconnects. [PDF]

Sensors (Basel), 2023
Hung TY, Chen GH, Lin YZ, Chow CW, Jian YH, Kuo PC, Peng CW, Tsai JF, Liu Y, Yeh CH.   +9 more
europepmc   +1 more source