Results 61 to 70 of about 34,816 (295)
Advanced Engineering Materials, EarlyView.Geometry‐driven thermal behavior in wire‐arc additive manufacturing (WAAM) influences microstructural evolution during nonequilibrium solidification of a chemically complex Fe–Cr–Nb–W–Mo–C nanocomposite system. By comparing different deposits configurations, distinct entropy–cooling rate correlations, segregation, and carbide evolution are revealed ...
Blanca Palacios +5 more
wiley +1 more source
Hybrid Optical Switching for Data Center Networks
Journal of Electrical and Computer Engineering, 2014 Current data centers networks rely on electronic switching and point-to-point interconnects. When considering future data center requirements, these solutions will raise issues in terms of flexibility, scalability, performance, and energy consumption ...
Matteo Fiorani +2 more
doaj +1 more source
VCSEL-Based Light Sources—Scalability Challenges for VCSEL-Based Multi-100- Gb/s Systems
IEEE Photonics Journal, 2012 Future high-performance computers require optical interconnects with aggregated Exa-Byte/s data transport. Densely packed arrays of vertical-cavity surface-emitting lasers (VCSELs) might present the only feasible technical solution.
Werner Hofmann, Dieter Bimberg
doaj +1 more source
Reconfigurable interconnects in DSM systems: a focus on context switch behavior [PDF]
, 2006 Recent advances in the development of reconfigurable optical interconnect technologies allow for the fabrication of low cost and run-time adaptable interconnects in large distributed shared-memory (DSM) multiprocessor machines.
Artundo, I +6 more
core +1 more source
Advanced Engineering Materials, EarlyView.A hierarchical porous copper current collector is fabricated via three‐dimensional printing combined with pressureless sintering to stabilize lithium metal anodes. The interconnected architecture lowers local current density, guides uniform Li deposition within pores, and suppresses dendrite growth.
Alok Kumar Mishra, Mukul Shukla
wiley +1 more source
A survey of carbon nanotube interconnects for energy efficient integrated circuits [PDF]
, 2017 This article is a review of the state-of-art carbon nanotube interconnects for Silicon application with respect to the recent literature. Amongst all the research on carbon nanotube interconnects, those discussed here cover 1) challenges with current ...
Amoroso, Salvatore +20 more
core +2 more sources
Advanced Engineering Materials, EarlyView.ZnS‐MXene‐TiO2 nanocomposite heterojunction for photocatalytic decomposition of this methylene blue dye (MB) greatly improves light absorption, charge separation, and active site area. Two‐dimensional MXene forms nanocomposites by easily combining them with 0D (quantum dots), 1D (tube and wire), 2D (plane and sheet), and 3D (particle and lamellar ...
Latiful Kabir +7 more
wiley +1 more source
Fault-tolerant optical interconnects for neutral-atom arrays
Physical Review ResearchWe analyze the use of photonic links to enable large-scale fault-tolerant connectivity of locally error-corrected modules based on neutral atom arrays.
Josiah Sinclair +5 more
doaj +1 more source
Demonstration of
IEEE Photonics Journal, 2014 Reduction in the operating voltage of electrooptic modulators is needed, in order to remove the bottleneck in the flow of data between electronics and optical interconnects.
David Borlaug +4 more
doaj +1 more source
HyPPI NoC: Bringing Hybrid Plasmonics to an Opto-Electronic Network-on-Chip
, 2017 As we move towards an era of hundreds of cores, the research community has witnessed the emergence of opto-electronic network on-chip designs based on nanophotonics, in order to achieve higher network throughput, lower latencies, and lower dynamic power.
El-Ghazawi, Tarek +4 more
core +1 more source